Grinding wheel for silicon and sapphire wafer edge grinding, chamfering grinding

Details

Specifications

Edge Wheel for Silicon Wafer Grinding

The unrounded silicon wafer is mounted onto a grinding chuck and a profile rounding wheel rounds the edge of the wafer. The edge profile is rounded to match the customer specifications.

Application of edge grinding wheel
Edge wheel/ chamfering wheels for silicon and sapphire wafer edge grinding. A small diamterer wheel for notch grinding.
silicon_wafers

- Metal diamond wheel for rough grinding to get accurate edge profile.
- Resin diamond wheel for finish grinding to get good surface roughness.

Features of edge wheel/ chamfer wheel
- Grinded with uniform chamfer width, excellent rigidity
- Strong groove shape retention, long life
- By edge grinding the final diameter is adjusted
- A uniform diamond layer minimizes machining damage
- Highly precise slotted shape support various wafer shapes

The specification of edge grinding wheels

D (mm)	T	Grit	bonded	Groove
50 - 250	3 - 20	325 - 3000#	Metal / resin	1-10G
Other size can be designed according to customers’ requirement

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Edge Grinding Wheel, Silicon Wafer Chamfering

Edge Wheel for Silicon Wafer Grinding

The specification of edge grinding wheels