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Applications of back grinding wheel
Back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, gallium arsenide, GaN wafers, silicon-based chips, etc
Applicable Grinding Machine
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc
| Model | D (mm) | T (mm) | H (mm) |
6A2/6A2H |
175 | 30, 35 | 76 |
| 200 | 35 | 76 | |
| 350 | 45 | 127 | |
6A2T |
195 | 22.5, 25 | 170 |
| 280 | 30 | 228.6 | |
6A2T(three ellipses) |
350 | 35 | 235 |
| 209 | 22.5 | 158 |
| Application | Grinding wafer silicon in the microchip industry |
| Bonded | Vitrified bond Diamond Wheel |
| Wheel Type | 12A2T /C |
| Size | 180*40*104*5*10, grit size 400# 180*40*104*5*10, grit size 1500# 180*40*104*5*10, grit size 4000# |
