resin bond diamond dicing blades for silicon wafer

Details

Specifications

Silicon Wafer Dicing - Resin bond Dicing Blades

Resin bonded blades have excellent cutting ability that help reduce chippingm fractures, can efficiency improve cut quality and efficiency on ductile and gummy materials such as QFNs and coppers and on hard and brittle materials such as glass and ceramic.
silicon wafer diamond dicing blades

Applications of diamond dicing blade
Resin Bond Diamond Dicing Blades are suitable for cutting scribing glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), BGA, QFN （copper epoxy molding ), splitter, sapphire, ceramic substrate, alumina, aliminum nitride, etc
silicon wafer dicing blades

Dresser Board for dressing dicing blades
Dresser board is used for dressing and edged blade row, to increase sharpness, and reduce the chipping of the work piece, to reshape and perfect the blade edge to a flat edge

How to selection of the correct types of dicing blades to cut materials

* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material

* Binder of metal bond (medium strength) dicing blade

* Binder of electroplated bond (hard bond), scribing softer material

Specifications of resin bond dicing blades

Grit Type	OD (mm)	ID(mm)	T(mm)	Grit Size
1A8 SD / CBN	50.8	25.4	0.05 - 0.3	#200 #3000
	57.1	38.1
	50.8-76.2	40
	101.6 ,114.3	69.8
	101.6, 114.3, 127	76.2
	108.1, 127	88.82
	108.1, 127	88.9
Special size can be designed depending on customers' requirement

Types	Features	Product Name
Electroformed dicing blade	Easy to handle Variety of different grit concentrations Stable processing performance	Hub dicing blade
	Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)
Resin bond dicing blade	High processing quality for cutting of hard, brittle materials Improved cut quality on hard materials	Hubless dicing blade
	Application:Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter
Metal bond dicing balde	High rigidity minimized wavy&slant cutting Excellent rigidity and cut quality
	Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP,
Electroformed dicing balde	Wide selection of blade options Proprietary thin-blade technology Blade thickness - 0.015 mm to 0.3 mm Available for both dicing saws and slicers
	Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon
Other specification can be produced according to customers' requirements

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Resin bond Diamond Dicing Blades for Silicon Wafer

Silicon Wafer Dicing - Resin bond Dicing Blades

Specifications of resin bond dicing blades