► 1A8 Ultra- Thin metal diamond dicing blade
► Thickness of dicing blade: 0.08mm - 2mm
► Silicon wafers of thickness 0.5 mm, 1 mm, 2 mm, 3 mm and 5 mm
► Inducing as low as possible frontside and backside chipping of silicon wafer
► Application: cutting / scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, ceramic, glass, crystal, etc
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Applications of metal diamond dicing blade
Scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, PCB, ceramic, glass, quartz, crystal, ferrite, optical communication (Faraday), etc
How to selection of the correct types of dicing blades to cut materials
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material
| 1A8 SD / CBN | OD | Thickness |
ID | ||||
| size | tolernace | size | Standard Tolernace | High precision Tolernace | Size | Tolernace | |
| 50 - 100 | + 0.02 | 0.1 - 0.15 | + - 0.005 | 25.4 30 31.75 40 60 80 88.9 |
+ - 0.02 | ||
| 0.15 - 0.25 | + - 0.005 | + - 0.003 | |||||
| > 0.25 | + - 0.005 | + - 0.003 | |||||
| Workpiece | PCB Material 1.2mm thick resin containing copper layer  |
| Dicing Requirements | Cutting without burrs |
| Incision perpendicularity < 0.005mm | |
| Cutting dimensional error < 0.02mm | |
| Snake cutting is not allowed | |
| Scribing Machine | Disco DAD3350 scribing machine |
Diamond Dicing Blade.jpg) |
Metal Diamond dicing blade |
| 58D x 0.15T x 40H (Grit 400#) | |
| Cutting Parameters | 1. Cutting direction: Straight cutting 2. Spindle speed: 30000rpm 3. Feed speed: 50mm/S 4. Cooling water: pure water |
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Types |
Features |
Product Name |
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Easy to handle Variety of different grit concentrations Stable processing performance |
Hub dicing blade |
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Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3) |
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High processing quality for cutting of hard, brittle materials
Improved cut quality on hard materials |
Hubless dicing blade |
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Application:Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter |
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High rigidity minimized wavy&slant cutting Excellent rigidity and cut quality |
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Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP, |
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Wide selection of blade options Proprietary thin-blade technology Blade thickness - 0.015 mm to 0.3 mm Available for both dicing saws and slicers |
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Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon |
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Other specification can be produced according to customers' requirements |
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