Aug 23, 2023
Back Grinding Wheel for Surface Grinding Customer Case Analysis
In the semiconductor industry, the grinding accuracy of Japanese equipment is pretty good at present, and there are grinding processes combining free and consolidation, as well as pure consolidation processes. Manufacturers who can usually afford Japanese equipment generally use pure consolidation preparation processes. The top three Japanese semiconductor precision processing equipment are: Disico, Tokyo Precision, and SHUWA. SHUWA is widely used in the field of sapphire with high precision.