► Application: LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers
► Grinding Machines: NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc
► Bonded: Vitrified bond & Resin bond
► Diameter of Back Grinding Wheel: 200mm, 250mm, 280mm, 300mm, 350mm
► Diameter of Epitaxial Wafer: 2", 4", 6"
LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. It works well with European, American, Japanese and Chinese grinding machines with an excellent performance and cost effectiveness.
What are the applicable Grinding Machine?
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc ).
What are the advantages of back grinding wheel for various wafer?
* With low damage and high quality
* Nodeless consecutive processing is possible by the superior sharpness
* It helps minimize processing damage, improve processing efficiency and reduce processing cost, and is customizable according to customer needs
* Cool polished section
* Good surface finishes
| Model | D (mm) | T (mm) | H (mm) |
6A2/6A2H |
175 | 30, 35 | 76 |
| 200 | 35 | 76 | |
| 350 | 45 | 127 | |
6A2T |
195 | 22.5, 25 | 170 |
| 280 | 30 | 228.6 | |
6A2T(three ellipses) |
350 | 35 | 235 |
| 209 | 22.5 | 158 |
| Application | Grinding wafer silicon in the microchip industry |
| Bonded | Vitrified bond Diamond Wheel |
| Wheel Type | 12A2T /C |
| Size | 180*40*104*5*10, grit size 400# 180*40*104*5*10, grit size 1500# 180*40*104*5*10, grit size 4000# |
