electroformed diamond dicing blades

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Specifications

electroformed dicing blades - hub type

Performance advantages of electroplating diamond dicing blades (hub type)
• High toughness, high precision, ultra thin, good chip removal and cooling performance, long service life
• Can carry on the difficult angle cutting and the step cutting processing
• The use of imported diamond abrasive through the electroplating process and precision aluminum alloy flange forming.
• By adjusting the blades strength, can reduce the snake like cutting and blade damage
• The workpiece has no flying edge, burr residue and high yield

Applications of hub type electroformed diamond dicing blade

Scribing dicing IC wafers, gallium arsenide, gallium phosphide, epoxy resin board, alloy frame, ceramic substrate, composite board with interlayer, etc
diamond dicing blades

Dresser Board for dressing dicing blades
Dresser board is used for dressing and edged blade row, to increase sharpness, and reduce the chipping of the work piece, to reshape and perfect the blade edge to a flat edge

How to selection of the correct types of dicing blades to cut materials

* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material

* Binder of metal bond (medium strength) dicing blade

* Binder of electroplated bond (hard bond), scribing softer material

Specifications of electroformed dicing blades

Exposure(μm)	380	510	640	760	890	1020	1150	1270	Grit Size
Kerf width(μm)	380-510	510-640	640-760	760-890	890-1020	1020-1150	1150-1270	1270-1400	#5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500
16-20	20*380	20*510
21-25	25*380	25*510	25*640
26-30	30*380	30*510	30*640	30*760	30*890	20*1020
31-35	35*380	35*510	35*640	35*760	35*890	35*1020
36-40	40*380	40*510	40*640	40*760	40*890	40*1020	40*1150
41-50	50*380	50*510	50*640	50*760	50*890	50*1020	50*1150
51-60		60*510	60*640	60*760	60*890	60*1020	60*1150	60*1270
61-70			70*640	70*760	70*890	70*1020	70*1150	70*1270
71-80					80*890	80*1020	80*1150	80*1270
81-90						90*1020	90*1150	90*1270
Special size can be designed according to customers' requirement

Types	Features	Product Name
Electroformed dicing blade	Easy to handle Variety of different grit concentrations Stable processing performance	Hub dicing blade
	Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)
Resin bond dicing blade	High processing quality for cutting of hard, brittle materials Improved cut quality on hard materials	Hubless dicing blade
	Application:Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter
Metal bond dicing balde	High rigidity minimized wavy&slant cutting Excellent rigidity and cut quality
	Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP,
Electroformed dicing balde	Wide selection of blade options Proprietary thin-blade technology Blade thickness - 0.015 mm to 0.3 mm Available for both dicing saws and slicers
	Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon
Other specification can be produced according to customers' requirements

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Electroformed Diamond Dicing Blades - Hub Type

electroformed dicing blades - hub type

Specifications of electroformed dicing blades