When grinding copper, it is typically recommended to use grinding wheels with relatively large porosity. Apart from the mentioned super-hard grinding wheels ( diamond and CBN mix abrasive grinding wheels) , other options suitable for copper grinding include corundum, silicon-carbide resin bonding wheels, or corundum ceramic bonding wheels that have large porosity. These types of wheels help facilitate the grinding process for copper materials by allowing efficient removal of material and preventing clogging.

In the semiconductor industry, the grinding accuracy of Japanese equipment is pretty good at present, and there are grinding processes combining free and consolidation, as well as pure consolidation processes. Manufacturers who can usually afford Japanese equipment generally use pure consolidation preparation processes. The top three Japanese semiconductor precision processing equipment are: Disico, Tokyo Precision, and SHUWA. SHUWA is widely used in the field of sapphire with high precision.

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At More Super Hard, we recently worked with a customer who required high-quality surface finishing for their Connecting Rod Kit, manufactured using tool steel. The customer's specific requirements were to achieve a roughness measurement of Ra0.2 or better, ensuring a smooth surface with no visible scratches.

Grinding wheel dressing refers to the operation process of dressing the grinding wheel into shape or removing the blunt surface with dressing tools, so as to restore the grinding performance and correct geometry of the working surface.

Whether the workpiece is made of soft or hard materials, from aluminum to zinc, from soft plastics to hard ceramics: whatever the characteristics of the workpiece, More Super Hard offers the optimal grinding solution to achieve high-precision plane parallelism.