NEWS
06
Sep

Moresuperhard Participation in The 24th China International Optoelectronic Exposition (CIOE2023)

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https://mogrinding.com/products/diamond-cutting-wheel/diamond-cutting-blade-saw-for-metallographic-cutting-machine.htmlExhibition time: September 6-8, 2023 (Wednesday-Friday) 
Venue: China - Shenzhen International Convention and Exhibition Center (Baoan New Venue) 
Address: No.1, Zhan Cheng Road, Fuhai Street, Baoan District, Shenzhen, Guangdong Province, China. 
Booth No.: 3E07

                       CIOE 2023

China International Optoelectronic Expo (CIOE) is the world's largest and most influential comprehensive exhibition of the optoelectronic industry, covering information and communications, lasers, infrared, ultraviolet, precision optics, chip materials, camera technology and applications, intelligent sensing, new display and other sections for the field of optoelectronics and applications to show the cutting-edge optoelectronic innovative technologies and comprehensive solutions, 2023 Mill Au Optoelectronics Group will once again go to the deep! In 2023, Mouma Optoelectronics Group will go to Shenzhen again to provide "cutting, grinding and polishing" solutions for your high-precision single-crystal cutting tools and the processing of photovoltaic semiconductor materials.

                  CIOE 2023

Moresuperhard will bring the following exhibits to meet you at this exhibition:

Precision Cutting blades:

                 CIOE 2023

Applicable to wafers, PCB substrates, ceramics, fiber optic connectors, optical glass, electronic parts, semiconductor packaging and other precision cutting.

Diamond Grinding Wheels for PCD tool grinding:

                CIOE 2023


This series of rough and fine grinding wheels have been successfully matched with COBORN RG5 and RG9A, EWAG-RS15, FC-200D, MT-188, MT198NC and other famous diamond tool grinding machines in China and other famous diamond tool grinding machines, with grit sizes ranging from W40 for rough grinding to 10,000# for ultra-fine grinding.
Rough grinding: W40, W20
Semi-fine grinding: W10,W7,W5
Fine Grinding: W3.5, W2.5, W1.5

                  CIOE 2023

This series of grinding wheels can be used in the UK PG3 or PG3B single crystal grinding machine for fine grinding edge.

Optical Grinding Wheels:

              CIOE 2023              


Suitable for precision grinding molds, punches, optical grinding and molding grinding and cutting tools and precision instrument workpiece material grinding processing. In addition, optical prism processing grinding wheels will also be exhibited together.

Back Grinding Wheels:

 
CIOE 2023

Can be used for chip, sapphire substrate, substrate epitaxial wafer, wafer, optical glass and other thinning.

Chamfering Wheels:

            CIOE 2023CIOE 2023

Used for silicon, silicon carbide, potassium arsenide, sapphire and other semiconductor wafers and LCD & OLED & MLED, glass and other semiconductor materials, substrate chamfering and beveling grinding process.

Diamond Grinding Wheels for Semiconductor Industry:

    CIOE 2023

It is suitable for the cylindrical grinding and roller grinding of monocrystalline silicon rods and polysilicon rods in the photovoltaic industry.

Double Endf-ace Grinding Disks:

          CIOE


Realize multiple semiconductor wafers and other semiconductor materials double-sided grinding at the same time, greatly improving the grinding efficiency. Double-sided grinding can effectively remove the wafer cutting damage layer caused by slicing and improve the flatness of the wafer.

Polishing pads, Grinding Pastes and Gluids:

         CIOE

Through CMP polishing to improve the roughness of the wafer, so that the surface of the epitaxial wafer epitaxial crystal level precision, the use of polishing pads, polishing fluid for silicon carbide, aluminum nitride, silicon nitride, phosphide steel, arsenide, nitride and other semiconductor materials for precision grinding and polishing.

Moresuperhard is committed to process research and development and reform and innovation, adhering to the "grinding to create more value than grinding" concept, for customers and the market to continue to provide high-quality "cutting, grinding and polishing" products for your high-precision single crystal tools and semiconductor, precision optical industry, to provide a full range of customized and efficient "cutting, grinding and polishing" products, to provide a full range of customized and efficient "grinding and polishing" products. Provide a full range of customized high-efficiency "cutting, grinding and polishing" solutions to help customers really realize cost reduction and efficiency.

We sincerely invite you to visit us!
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