Nov

The chip is square while wafer is round?

The wafer is round, but the chip made from the wafer is square. This is mainly because of the utilization of the wafer in the chip manufacturing, and the ease of cutting. In addition, the chip is square, which is easier to wire.
silicion wafer and chip

Why the chip is round?
The basic material of chips is single crystal silicon, which is first made into wafers, which are then finely machined using techniques such as photolithography and etching, and then cut into hundreds of chips.
Whether in computers or mobile phones, chips are mostly made into squares. The main reasons for making them square rather than round are as follows:
1. Circular chips waste a lot of scrap when cutting wafers, and make rectangles (rectangles include squares) to minimize the waste of scrap.
2. The chip is a product with very high precision, in wafer cutting, straight cutting is the most convenient, arc cutting has high requirements for cutting tools, and the crystal core of monocrystalline silicon itself has direction, arc cutting is easy to cut the edge of the chip.
3. The rectangular chip is more convenient for positioning during wiring and installation. If it is made into a circle, even a slight Angle deviation may lead to errors in wiring and installation due to the rotation symmetry of the circle at any Angle.
4. Electronic products have a high degree of integration, and the circular chip is not conducive to the overall layout of the circuit board.
Of course, in addition to squares, regular triangles and hexagons can also be cut in straight lines without wasting scraps. However, the research, design and manufacture of chips has been developed iteratively after decades of technology, and finally the square design was chosen.
silicon wafer

If chips are square, why are wafers round?
The melting point of silicon is 141, and the monocrystalline silicon used in the chip has a very high requirement for purity. 99.9999% pure silicon can be used as solar photovoltaic panels, but it is far from enough to meet the requirements of chip level. The purity of monocrystalline silicon on the chip is at least 99.999999%. But the production is not enough to meet domestic demand, and a large part of it needs to be imported.
High purity of monocrystalline silicon cut using Klaus (czochralski method) for manufacturing base method, the method USES quartz crucible melting the polysilicon, and keep the temperature about 1500 ℃, the rotate at a constant speed and then use a child crystal in the crucible, crucible reverse rotation at the same time, the chip and slowly lift up the son, and the molten state of silicon crystal growth along the son, The result is a cylindrical silicon ingot, known as monocrystalline silicon, with a diameter of up to 30 centimeters and a length of up to 1 meter.
When we slice silicon ingots, we get wafers, so wafers are round, and even though round wafers waste some of the waste, wafers are much bigger than chips, and one wafer can make hundreds of chips.

---EDITOR: Doris Hu

---POST: Doris Hu

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