Centerless grinding: the center hole of the workpiece does not need to be centered during the grinding process.

We recently received feedback from an Iranian customer who encountered an issue with the plated CBN grinding wheels they purchased from us. The customer reported that the wheels were causing burns on the workpiece during grinding.   

Workpiece size (mm):
ID: 35~63
OD: 32~112
Length: 220~600

Workpiece material: 38CrMoAl

Advanced nitrided steel with high wear resistance, high fatigue strengt

The customer is a manufacturer of high boron glass tubes used in scientific and industrial applications. They have their own honing machine and require a diamond honing stone to achieve a surface finish of R0.1 on the inner walls of the glass tubes. The high boron content makes the glass tube extremely hard and difficult to polish using conventional methods.

When grinding copper, it is typically recommended to use grinding wheels with relatively large porosity. Apart from the mentioned super-hard grinding wheels ( diamond and CBN mix abrasive grinding wheels) , other options suitable for copper grinding include corundum, silicon-carbide resin bonding wheels, or corundum ceramic bonding wheels that have large porosity. These types of wheels help facilitate the grinding process for copper materials by allowing efficient removal of material and preventing clogging.

In the semiconductor industry, the grinding accuracy of Japanese equipment is pretty good at present, and there are grinding processes combining free and consolidation, as well as pure consolidation processes. Manufacturers who can usually afford Japanese equipment generally use pure consolidation preparation processes. The top three Japanese semiconductor precision processing equipment are: Disico, Tokyo Precision, and SHUWA. SHUWA is widely used in the field of sapphire with high precision.