The combination of resin and metal bond to abrasive is generally considered to be the mechanical inlaying force, but due to little or no pores, the grinding wheel has a high strength (although there is a saying: "Strong carbide forming elements can generate carbide and diamond reaction, the formation of chemical combination", but it's only a theory, not a strong experimental observation to the existence of the carbide), ceramic bond can form and abrasive chemical combination, but due to the brittle ceramic bond, high impact load, the abrasive loss is more serious.
The choice of bond, on the one hand, is the choice of bond type. Due to the progress of product technology, many processing areas, resin bond grinding wheel can be processed, ceramic bond grinding wheel can be processed, or metal bond grinding wheel can be processed, and how to optimize the grinding scheme, this is the industry to consider. On the other hand, is the choice of bond system. For example, there are many systems or types of each bond, and it is also very difficult to choose or prepare the bond according to the specific grinding requirements.

Silicon wafer back grinding is generally divided into two steps: rough grinding and fine grinding.
In the rough grinding stage, the diamond wheel with grit 46 # ~ 500 # , the axial feed speed is 100 ~ 500mm/min, and the grinding depth is generally 0.5 ~ 1mm.
The aim is to quickly remove most of the excess material (90% of the processing allowance) from the back of the silicon wafer.
In the process of fine grinding, the machining allowance is from several microns to more than ten microns. The diamond grinding wheel with grit 2000 # ~ 4000 #, and the axial feeding speed is 0.5 ~ 10mm/min.
It is mainly to eliminate the damage layer formed during rough grinding to reach the required thickness. In the fine grinding stage, the material is removed by ductility domain mode, and the surface damage of silicon wafer is significantly reduced.

PCD tool must ensure good cutting edge before machining workpiece. Diamond grinding wheel is the most widely used method. The higher the quality of the cutting edge, the finer the tool mark left at the junction of the geometric reflection region of the workpiece surface, and the higher the surface finish of the workpiece. Because cutting edge collapse or expansion easily cause tool wear or damage, reduce tool life. Edge collapse is a key index of edge quality of diamond tools.

The grain size of diamond grinding wheel should be one point coarser than that of the dressing grinding wheel, and the size of diamond particles should be close to the same, and the shape of diamond particles is approximately spherical. The commonly used particle size is 36# ~100#.

Peripheral Diamond Grinding wheels are used for indexable inserts grinding. Peripheral Diamond Grinding wheels for indexable inserts, must be of a high level of geometrical accuracy, with ability of significant material removal.
Grinding wheel size: D400*W12*X6, W20
Grinding inserts：CBN, SNGA two-edge
Equipment: HI-powerful Peripheral grinding machine HP400 PLUS

iamond powder is mainly used for grinding and polishing, the control of particle size is particularly important. As long as there are oversized coarse particles will cause workpiece scratches so that preceding operation come to naught. So the quality inspection of powder is an important link to ensure the quality of powder products.