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Diamond Dicing Blade for DFN Semiconductor packaging
Dec 02, 2020
Diamond Dicing Blade for DFN Semiconductor packaging
The Diamond dicing blade is mounted on the soft blade flange of the cutting equipment's spindle
 International Forum & Exhibition on Precision Manufacturing at Kunshan
Dec 02, 2020
Moresuperhard set off again --- Attend International Forum & Exhibition on Precision Manufacturing at Kunshan
The forum will have the invited oral presentations from the engineering practitioners, leading researchers, industrialists and academics, and in parallel the industrial exhibitions from leading companies in the field.
Cutting of DFN Finished Products
Dec 01, 2020
Semiconductor Packaging --The Cutting of DFN Finished Products
With the continuous progress of electronic information, the semiconductor industry is also changing with each passing day.
Why is it necessary to grind after hard turning
Nov 30, 2020
Why is it necessary to grind after hard turning?
The purpose of grinding as the finishing step is to obtain the surface quality which cannot be achieved by hard machining.
Diamond grinding Pad
Nov 28, 2020
Diamond grinding Pad
Diamond Grinding Pad is suitable for Crystalline, optical glass and other application Brittle glassy material.
DMP Greater Bay Area Industrial Expo
Nov 26, 2020
DMP Greater Bay Area Industrial Expo
The "DMP Greater Bay Area Industrial Expo" will be held in Shenzhen International Convention and Exhibition Center (New Pavilion) from November 24 to 27, 2020, with an estimated scale of 320,000 square meters.
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