Home » Application » Silicon Back Grinding Wheels For Simiconductor Field

Silicon Back Grinding Wheels For Simiconductor Field

Manufacturing processes for silicon semiconductor
Silicon Ingot ⇒ Cropping(electroplated bandsaw) ⇒ Cylindrical / Flat Grinding Silicon Rod ⇒ Ingot Silicon (diamond wire) ⇒ Lapping (double side wheel/polishing pad) ⇒ Edge Grinding ⇒ Surface grinding ⇒ polishing⇒ wafer⇒ patterning ⇒ back grinding (vitrified / resin wheels) ⇒ dicing (dicing blades)⇒ chips ⇒ molding ⇒ packaging

Rated 4.9/5 based on 246 customer reviews
Share:
Content
Inquiry
* Name:
* Email:
Country:
Tel:
* Message:
More Vitrified bond Diamond CBN Wheels