Grinding Solution

Application: sculpturing, dressing and internal grinding carbide, ceramic,glass, stones, marble,etc

Application: sculpturing, dressing and internal grinding carbide, ceramic,glass, stones, marble,etc

Types of internal grinding wheel:
* vitrified cbn internal grinding wheel
* resin diamond & cbn internal wheel
* electroplated diamond mounted points
* abrasive internal grinding wheel

Application: sculpturing, dressing and internal grinding carbide, ceramic,glass, stones, marble,etc

Types of internal grinding wheel:
* vitrified cbn internal grinding wheel
* resin diamond & cbn internal wheel
* electroplated diamond mounted points
* abrasive internal grinding wheel

Last week, Moresuperhard participated in the 2nd conference on ceramic technology for semiconductor industry.

We are committed to improving the quality of our products and services to provide customers with better grinding results and value!
Email: [email protected]
Whatsapp: 8615838271917

► Edge wheel for silicon and sapphire wafer edge grinding. A small diameter wheel is used for notch grinding
► Metal diamond wheel for rough grinding to get an accurate edge profile
► Resin diamond wheel for finish grinding to get good surface roughness

Best suited for demanding applications where a harder-wearing, longer-lasting blade is required.
specifications can be made according to customers requirements

Moresuperhard provides qualified services For DANOBAT’s Precision Grinding Machines.
External grinding models：CG, PG, LG, HG, WT, mBTG-DANTIP,
Internal grinding models: ID, IRD,ILD, IED.

► Vitrified diamond/CBN grinding wheels
► Resind diamond/CBN grinding wheels
► Conventional grinding wheels
► Diamond dressing wheels

Silicon wafer back grinding, resin/vitrified/metal bond diamond wheels are used for back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer

Silicon wafer back grinding, resin/vitrified bond diamond wheels are used for back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer

What Types of internal grinding wheels do we have?
* vitrified CBN internal grinding wheel
* resin diamond & CBN internal wheel
* electroplated diamond mounted points
* abrasive internal grinding wheel

► Polishing and finishing of glass, LCD/LED substrates, precision optics, hard disk, metal and semiconductor wafer surfaces
► Model: MSH-66, MSH-77, MSH-13, MSH-LASER, MSH-46
► Thickness: 0.02″ (0.508 mm) – 0.20″ (5.08 mm)

Moresuperhard provides customized resin or electroplated diamond belts. There are many grinding advantages such as sharpness, durability, flexibility, and dry or wet grinding for diamond sanding abrasive belts with various patterns. Please choose different design patterns according to your needs.

Moresuperhard high-precision electroplating CBN grinding rod (JG coordinate grinding rod) is equipped with imported continuous orbital CNC coordinate grinding machine (such as Moore Moore, Hauser Hauser, Mitsuiseiki Mitsui, Waida and Ida, etc.) to process fine molds, in the production of motor molds, leads Structural molds, semiconductor special molding molds and other fields are widely used. Products can be customized for special types according to customer requirements, such as roughing, finishing, polishing and other special requirements can be satisfied.

CNC coordinate grinder is used to process continuous dies of electronic components, fine punching dies, scoring dies and engineering plastic dies of camera and watch parts.