Resin diamond & cbn wheels used for machining tungsten carbide cutting tools, ceramic ,magnetic materials, silicon ,glass ,quartz and high speed steel,etc
► Application: precise grinding mould and die, punch pin, optical grinding and form grinding cutting tool ( such as end mill and reamer) and precise instrument ► Model: 3A1, 14K1, 1B9 ► Bonded: resin bond & metal bond ► Optical Profile Grinder: Amada, Waida, Wasion, etc
High Precision Resin diamond grinding wheels are widely used in semi-precision grinding, fine grinding and polishing of cemented carbide tools, PDC cutter, PDC drill bits, ceramics, magnetic materials, crystals and other materials. Size of resin bonded diamond wheel: D60* 12.7* 19* 10MM
Peripheral Diamond Grinding wheels for indexable inserts, must be of a high level of geometrical accuracy, with ability of significant material removal. We are able to produce various types wheels to suit all popular machines, such as WENDT, WAIDA, AGATHON, EWAG, COBORN, etc.
Diamond grinding wheel resinoid bonded is mainly used for grinding high and hard alloys, non-metallic materials, cutting hard and brittle hard alloys, non-metallic minerals, etc. Such as cemented carbide, ceramics, agate, optical glass, semiconductor materials, wear-resistant cast iron, stone, etc.
Resinoid bond diamond grinding wheel has good self-sharpening, elasticity and good polishing and grinding performance. Resin diamond & cbn wheels used for grinding tungsten carbide, ceramic, magnetic materials, silicon, glass, quartz and high speed steel, etc
Peripheral Diamond Grinding wheels for indexable inserts, must be of a high level of geometrical accuracy, with ability of significant material removal. We are able to produce various types wheels to suit all popular machines, such as WENDT, WAIDA, AGATHON, EWAG, COBORN, etc. AGATHON 400 PENTA 5-axis insert grinder is a fully automatic grinding center of the latest generation providing increased efficiency for insert production, the wheels used on AGATON are up to 400mm diameter. Which can grind most tool geometries with flexible clamping system. AGATHON laser machine can reduce the PCD processing time when make tool insert rough cutting, which can take place the rough grinding sometimes.
Moresuperhard provides qualified services For DANOBAT Precision Grinding Machines. Centerless grinding models：VG, DVG
► Resind diamond/CBN grinding wheels ► Conventional grinding wheels ► Diamond dressing wheels
Resin bond diamond wheels Processing object: PDC (polycrystalline diamond composite) drill bits Applicable industries: manufacturers of PDC drill bits (for example: geological drill bits, oil field mining drill bits, etc.)
Resin diamond grinding wheel: widely used in semi-precision grinding, fine grinding and polishing of cemented carbide tools, PDC cutter, PDC drill bits, ceramics, magnetic materials, crystals and other materials Resin CBN grinding wheel: mainly used for grinding cast iron, high-speed steel containing tungsten and molybdenum, vanadium alloy steel, cobalt alloy steel, and quenched steel
►Excellent Grinding Action ►less apt to experience loading, and they dress easily for added convenience ►Convenience and Ease of Use ►Grinding abilities apply to both wet and dry tasks on processing objects such as harden steel, glass, ceramic, carbide alloys, ferrite, refractories, semi conductors, and other electrical carbon products.
What are the characteristics of resin diamond grinding wheels? Resin bond is an organic bond. The resin diamond grinding wheel manufactured by this bond has high strength, certain elasticity, low heat resistance, good self-sharpening, simple production, and short process cycle. It can manufacture grinding wheels with working speed higher than 50 m/s and very thin grinding wheels.
► OD cylindrical grinding wheel (1A1 shape) ► Diamond sanding belts ► Diamond internal grinding wheel ► Diamond honing stone Model: 1A1 diamond wheel (diameter up to 1100mm)
Resin diamond grinding wheels are widely used in cylindrical grinding semi-precision grinding, fine grinding and polishing of cemented carbide tools, PDC cutter, PDC drill bits, ceramics, magnetic materials, crystals and other materials
What Types of internal grinding wheels do we have? * vitrified CBN internal grinding wheel * resin diamond & CBN internal wheel * electroplated diamond mounted points * abrasive internal grinding wheel
Resin bonded diamond grinding wheels for peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat. Materials used in semiconductors and electronics parts, automobiles and photovoltaic industry. Types of these materials are varied including silicon, sapphire, and gallium arsenide (GaAs).
Model: 4V9, 4BT9, 4V4, 14EE1 Bonded: resin bond, metal bond Application of cbn grinding wheels: forming and grinding of high speed steel (hss) gear hob and thread cutting tools Width of CBN wheel abrasive layer is generally 3mm -5mm, and the thickness is between 2mm
► Application: precise grinding mould and die, punch pin, optical grinding and form grinding cutting tool ( such as end mill and reamer) and precise instrument ► Model: 1A1, 3A1, 14A1, 1V1, 11V9, 12V9, 4B1, 3A1, 14K1, 1B9 ► Bonded: resin bond & metal bond ► Optical Profile Grinder: Amada, Waida, Wasion, etc
High Precision optical profile grinding wheels are used for profile grinding punching, grinding and slotting of precision tungsten steel parts, USB, IC, LED and other accessories, long product life, strong cutting force, and improve work efficiency. Optical profile grinders: WAIDA, WASINO and other projection optical machine
Resin bond diamond cylindrical grinding wheels for the oil and gas industry, providing precise solutions for resin bond diamond cylindrical grinding wheel for PCD/carbide, wear parts and gage blocks for oil & gas drill manufacturing.
► Application: grinding carbide and HSS. (such as drill, end mill, reamer) ► A complete solution for CNC tools manufacturing: fluting, gashing and Clear edge, relief angle grinding, OD grinding ► Model: 1A1, 1V1, 11V9, 12V9, 14A1, 12V5, etc
Silicon wafer back grinding, resin bond diamond wheels are used for back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer
