Resin diamond & cbn wheels used for machining tungsten carbide cutting tools, ceramic ,magnetic materials, silicon ,glass ,quartz and high speed steel,etc
Resin bond diamond wheel for silicon wafer can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.
Resin diamond grinding wheels Applicable Industry: carbide inserts (cnc tools), carbide circular saw (woodworking tools), Thermal Spraying Coated, Silicon Wafer Grinding, etc
Resin bond diamond cylindrical grinding wheels for the oil and gas industry, providing precise solutions for resin bond diamond cylindrical grinding wheel for PCD/carbide, wear parts and gage blocks for oil & gas drill manufacturing.
Resinoid bond diamond grinding wheel has good self-sharpening, elasticity and good polishing and grinding performance. Resin diamond & cbn wheels used for grinding tungsten carbide, ceramic, magnetic materials, silicon, glass, quartz and high speed steel, etc
Resin diamond grinding wheel: widely used in semi-precision grinding, fine grinding and polishing of cemented carbide tools, PDC cutter, PDC drill bits, ceramics, magnetic materials, crystals and other materials Resin CBN grinding wheel: mainly used for grinding cast iron, high-speed steel containing tungsten and molybdenum, vanadium alloy steel, cobalt alloy steel, and quenched steel
Resin bonded diamond wheels are mainly used for grinding carbide, non-metallic material, crispy hard alloy, non-metallic mineral, such as carbide, ceramic, agate, silicon,magnetic,self-fluxing alloy material,PCD & PCDN, wear resistant cast iron, stone materials
►Excellent Grinding Action ►less apt to experience loading, and they dress easily for added convenience ►Convenience and Ease of Use ►Grinding abilities apply to both wet and dry tasks on processing objects such as harden steel, glass, ceramic, carbide alloys, ferrite, refractories, semi conductors, and other electrical carbon products.
Resin bonded diamond grinding wheels applied to coarse grinding and finish grinding for metal materials, such as PCD and PCBN workpiece and tools, high speed steel, high vanadium steel, stainless steel, steel and hard alloy. For finishing grinding, polishing and ultra-finish grinding stage processing nonmetallic hard and brittle materials such as glass, stone, ceramics, gem, magnetic, etc.
Resin diamond peripheral wheel is mainly used for the peripheral grinding of indexable blade, plane cutter, milling , cutting blade, welding blade, machine clip blade, carbide, ceramics, cermets, PCD, CBN, etc Including the grinding of end face, radius and relief angle.
High Precision Resin diamond grinding wheels are widely used in semi-precision grinding, fine grinding and polishing of cemented carbide tools, PDC cutter, PDC drill bits, ceramics, magnetic materials, crystals and other materials. Size of resin bonded diamond wheel: D60* 12.7* 19* 10MM
The bakc grinding wheels include vitrified bond and resin bond diamond wheels. Application of back grinding wheels: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer
High Precision optical profile grinding wheels are used for profile grinding punching, grinding and slotting of precision tungsten steel parts, USB, IC, LED and other accessories, long product life, strong cutting force, and improve work efficiency. Optical profile grinders: WAIDA, WASINO and other projection optical machine
Resin bonded diamond grinding wheels are used for finishing grinding, polishing and ultra-finish grinding stage processing nonmetallic hard and brittle materials such as glass, stone, ceramics, gem, magnetic, etc.
What are the characteristics of resin diamond grinding wheels? Resin bond is an organic bond. The resin diamond grinding wheel manufactured by this bond has high strength, certain elasticity, low heat resistance, good self-sharpening, simple production, and short process cycle. It can manufacture grinding wheels with working speed higher than 50 m/s and very thin grinding wheels.
Resin diamond & cbn wheels used for machining tungsten carbide cutting tools, ceramic ,magnetic materials, silicon, glass, quartz and high speed steel, etc
► Application: precision grinding micro drill tools Advantages of micro tool grinding wheel: * Good edge stability * High cutting efficiency * Minimal reject-part rates * Good round tool quality
► Application: grinding carbide and HSS. (such as drill, end mill, reamer) ► A complete solution for CNC tools manufacturing: fluting, gashing and Clear edge, relief angle grinding, OD grinding ► Model: 1A1, 1V1, 11V9, 12V9, 14A1, 12V5, etc
Resin bond diamond wheel is solidified at low temperature, the production cycle is short, and the equipment and supply process are relatively simple; because the resin has fluidity, it is easy to form a grinding wheel with a complex surface.
► Application: precise grinding mould and die, punch pin, optical grinding and form grinding cutting tool ( such as end mill and reamer) and precise instrument ► Model: 1A1, 3A1, 14A1, 1V1, 11V9, 12V9, 4B1, 3A1, 14K1, 1B9 ► Bonded: resin bond & metal bond ► Optical Profile Grinder: Amada, Waida, Wasion, etc
Resin Bond diamond wheels are mostly used for precision grinding of cemented carbide, cermets and ceramics. Because of the bond elasticity, they are used for finish grinding of silicon, glass, ceramic-made electrical parts, etc. which require excellent surface finish. Resin bond wheels are suitable for grinding ferrous metals such as cast iron, high speed steels, and sintered iron. They are suitable for processing hard to machine materials because CBN grains are much stronger than conventional abrasives.
Silicon wafer back grinding, resin bond diamond wheels are used for back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer
► OD cylindrical grinding wheel (1A1 shape) ► Diamond sanding belts ► Diamond internal grinding wheel ► Diamond honing stone Model: 1A1 diamond wheel (diameter up to 1100mm)
Resin bond cbn wheels are widely applied for asferrous materials such as high-speed steels and sintered ferrous metals
