► OD cylindrical grinding wheel (1A1 shape) ► Diamond sanding belts ► Diamond internal grinding wheel ► Diamond honing stone Model: 1A1 diamond wheel (diameter up to 1100mm)
► Application: precise grinding mould and die, punch pin, optical grinding and form grinding cutting tool ( such as end mill and reamer) and precise instrument ► Model: 1A1, 3A1, 14A1, 1V1, 11V9, 12V9, 4B1, 3A1, 14K1, 1B9 ► Bonded: resin bond & metal bond ► Optical Profile Grinder: Amada, Waida, Wasion, etc
►Excellent Grinding Action ►less apt to experience loading, and they dress easily for added convenience ►Convenience and Ease of Use ►Grinding abilities apply to both wet and dry tasks on processing objects such as harden steel, glass, ceramic, carbide alloys, ferrite, refractories, semi conductors, and other electrical carbon products.
Resin bond cbn wheels are widely applied for asferrous materials such as high-speed steels and sintered ferrous metals
Moresuperhard company’s diamond grinding wheel resinoid bonded can choose a variety of grinding wheels according to the product model: (Parallel grinding wheel, parallel arc grinding wheel, double-sided concave grinding wheel, double bevel grinding wheel, bowl-shaped grinding wheel, etc.)
Peripheral Diamond Grinding wheels are used for indexable inserts grinding. Peripheral Grinding tungsten carbide inserts, ceramic inserts, cermet, pcd and cbn inserts Model: 6A2T, 6A2M, 11A2B, 12A2T Bonded: resin bond and vitrified bond
Resin bond grinding wheels are the most commonly used super abrasive product currently. our resin diamond wheel is suitable for surface grinding, OD grinding, centerless grinding, tool grinding, fine grinding ,double disc grinding and slot grinding of most precision workpieces.
What Types of internal grinding wheels do we have? * vitrified CBN internal grinding wheel * resin diamond & CBN internal wheel * electroplated diamond mounted points * abrasive internal grinding wheel
Type: 1A1 & 1A1R Application: cutting tungsten carbide, alloys, quartz, ceramics, glass, carbon fibre composites, fiber glass, HSS, Hardened Steel and other ferrous material.
Resin Diamond Wheel for PDC Cutter / Drill Bits Grinding. Resin bond diamond wheel is widely used in semi-precision grinding, fine grinding and polishing of cemented carbide, pdc composite sheet, PDC drill bits, ceramics, magnetic materials, crystals and other materials.
Resin diamond grinding wheels Applicable Industry: carbide inserts (cnc tools), carbide circular saw (woodworking tools), Thermal Spraying Coated, Silicon Wafer Grinding, etc
Resin Bond diamond wheels are mostly used for precision grinding of cemented carbide, cermets and ceramics.
Resin bond diamond cylindrical grinding wheels for the oil and gas industry, providing precise solutions for resin bond diamond cylindrical grinding wheel for PCD/carbide, wear parts and gage blocks for oil & gas drill manufacturing.
— Applications: face grinding, top grinding, flank grinding, hollow tooth grinding and re-sharpening for tungsten carbide tipped saw blades and one-piece HSS saws — Models: 4A2, 4BT9, 11A2, 15A2, 12V2, 14F1, etc — Bonded: Resin bond, vitrified bond — Grinding Machine: Vollmer, Woodtronic, Akemat, Widma and so on
What are the characteristics of resin diamond grinding wheels? Resin bond is an organic bond. The resin diamond grinding wheel manufactured by this bond has high strength, certain elasticity, low heat resistance, good self-sharpening, simple production, and short process cycle. It can manufacture grinding wheels with working speed higher than 50 m/s and very thin grinding wheels.
► Good concentricity, less runout, small tolerance ► Round hole/Face/Square hole/Arc/Groove/ Spherical/ contour grinding ► Bond: resin bond/ electroplated/ vitrified ► Grinding machine: Moore, Hauser, Mitsuiseiki, Waida and Jingtian, etc. ► Grit：40 #-1000#
► Application: precise grinding mould and die, punch pin, optical grinding and form grinding cutting tool ( such as end mill and reamer) and precise instrument ► Model: 3A1, 14K1, 1B9 ► Bonded: resin bond & metal bond ► Optical Profile Grinder: Amada, Waida, Wasion, etc
Resin bonded diamond wheels are mainly used for grinding carbide, non-metallic material, crispy hard alloy, non-metallic mineral, such as carbide, ceramic, agate, silicon,magnetic,self-fluxing alloy material,PCD & PCDN, wear resistant cast iron, stone materials
Straight type resin diamond cbn wheels Model: 1A1R, 1A1, 3A1, 1V1, 4A2, 4BT9, 6A2, 11V9, 12A2, 14F, etc Workpiece Materials: grinding tungsten carbide cutting tools, ceramic , magnetic materials, silicon , sapphire, glass , quartz and HVOF carbide coated,PCD, PCBN, etc
Resin diamond grinding wheels for grinding carbide, cemented carbide, ceramics, agate, optical glass, semiconductor materials, wear-resistant cast iron, stone, etc. Type: flat, dish, cup Grinding: surface grinding, centerless grinding, cylindrical grinding, internal grinding Model: 1a1, 1a2, 6a2, 11v9, 14a1, 14f1, etc
Peripheral Diamond Grinding wheels for indexable inserts, must be of a high level of geometrical accuracy, with ability of significant material removal. We are able to produce various types wheels to suit all popular machines, such as WENDT, WAIDA, AGATHON, EWAG, COBORN, etc. AGATHON 400 PENTA 5-axis insert grinder is a fully automatic grinding center of the latest generation providing increased efficiency for insert production, the wheels used on AGATON are up to 400mm diameter. Which can grind most tool geometries with flexible clamping system. AGATHON laser machine can reduce the PCD processing time when make tool insert rough cutting, which can take place the rough grinding sometimes.
Resin diamond & cbn wheels used for machining tungsten carbide cutting tools, ceramic ,magnetic materials, silicon ,glass ,quartz and high speed steel,etc
Resin diamond peripheral wheel is mainly used for the peripheral grinding of indexable blade, plane cutter, milling , cutting blade, welding blade, machine clip blade, carbide, ceramics, cermets, PCD, CBN, etc Including the grinding of end face, radius and relief angle.
Manufacturing processes for silicon semicond Silicon Ingot ⇒ Cropping(electroplated bandsaw) ⇒ Cylindrical / Flat Grinding Silicon Rod ⇒ Ingot Silicon (diamond wire) ⇒ Lapping (double side wheel/polishing pad) ⇒ Edge Grinding ⇒ Surface grinding ⇒ polishing⇒ wafer⇒ patterning ⇒ back grinding (vitrified / resin wheels) ⇒ dicing (dicing blades)⇒ chips ⇒ molding ⇒ packaging Moresuperhard provides a full range of silicon wafer grinding solution and service.
