What is a PG grinding wheel/optical profile grinder grinding wheel? Optical profile grinder processing must be equipped with a plotter. After drawing the shape sample of the workpiece to be formed, it is enlarged 20 times or 50 times, and then it is made into a film and pasted on the projection screen and processed according to the drawing. Bonded: resin bond and metal bond grinding wheel
Moresuperhard CBN wheel is suitable for high precision formed wheels. Such as grinding of high precision gear, worm gear hob, gearbox shafts, planetary reducers (sun gear, planetary gears), worm reducers (yin and yang rotors), stator inner teeth and outer rotor grinding.
Resin Bond diamond wheels are mostly used for precision grinding of cemented carbide, cermets and ceramics. Because of the bond elasticity, they are used for finish grinding of silicon, glass, ceramic-made electrical parts, etc. which require excellent surface finish. Resin bond wheels are suitable for grinding ferrous metals such as cast iron, high speed steels, and sintered iron. They are suitable for processing hard to machine materials because CBN grains are much stronger than conventional abrasives.
►Excellent Grinding Action ►less apt to experience loading, and they dress easily for added convenience ►Convenience and Ease of Use ►Grinding abilities apply to both wet and dry tasks on processing objects such as harden steel, glass, ceramic, carbide alloys, ferrite, refractories, semi conductors, and other electrical carbon products.
According to the bond, diamond grinding wheels can be divided into: resin bond diamond grinding wheels; ceramic bond diamond grinding wheels; metal bond diamond grinding wheels (bronze bond diamond grinding wheels) Resin diamond grinding wheels are used for grinding and processing hard and brittle materials and metal materials such as carbide, glass, ceramics, ferrite, semiconductor materials, stone, etc.
► Application: precise grinding mould and die, punch pin, optical grinding and form grinding cutting tool ( such as end mill and reamer) and precise instrument ► Model: 3A1, 14K1, 1B9 ► Bonded: resin bond & metal bond ► Optical Profile Grinder: Amada, Waida, Wasion, etc
Peripheral Diamond Grinding wheels are used for indexable inserts grinding. Peripheral Grinding tungsten carbide inserts, ceramic inserts, cermet, pcd and cbn inserts Model: 6A2T, 6A2M, 11A2B, 12A2T Bonded: resin bond and vitrified bond
Moresuperhard provides qualified services For DANOBAT Precision Grinding Machines. Centerless grinding models：VG, DVG
► Resind diamond/CBN grinding wheels ► Conventional grinding wheels ► Diamond dressing wheels
Diamond grinding wheel resinoid bonded is mainly used for grinding high and hard alloys, non-metallic materials, cutting hard and brittle hard alloys, non-metallic minerals, etc. Such as cemented carbide, ceramics, agate, optical glass, semiconductor materials, wear-resistant cast iron, stone, etc.
Resin diamond wheels for grinding tungsten carbide and HSS steel. Such as drills, end mills, reamers, micro drills, mini end mills and burrs, etc Type: 1A1,1V1,1A1R,6A2,6A9,3A1,9A1,11V9,12A2,14A1 etc. Moresuperhard has more than 15 years’ experience in producing diamond and cbn grinding wheels.
Resinoid bond diamond cbn grinding wheels are used For finishing grinding, polishing and ultra-finish grinding stage processing nonmetallic hard and brittle materials such as glass, stone, ceramics, gem, magnetic, etc. Various kinds of dimensions and shapes are available, such as flat shapes, cup shapes and dish shapes, etc.
► Bonded: resin bonded ► Application: precision grinding micro drill tools Advantages of micro tool grinding wheel: * Good edge stability * High cutting efficiency * Minimal reject-part rates * Good round tool quality
Resin Bond diamond wheels are mostly used for precision grinding, surface grinding, centerless grinding, cylindrical grinding, internal grinding of carbide, cermets and ceramics, glass, magnetic materials, quartz glass, etc. Size of resin diamond wheel: 60mmx 12.7mm x 19mm x 10mm
Resin bonded diamond grinding wheels for peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat. Materials used in semiconductors and electronics parts, automobiles and photovoltaic industry. Types of these materials are varied including silicon, sapphire, and gallium arsenide (GaAs).
Resin bonded diamond grinding wheel • For grinding tungsten carbide and steel materials • High material removal volumes at low grinding forces • For wet and dry grinding • High flexibility by mixing in suitable additives • For fine grinding operations
Resin bond diamond wheels Processing object: PDC (polycrystalline diamond composite) drill bits Applicable industries: manufacturers of PDC drill bits (for example: geological drill bits, oil field mining drill bits, etc.)
Peripheral Diamond Grinding wheels for indexable inserts, must be of a high level of geometrical accuracy, with ability of significant material removal. We are able to produce various types wheels to suit all popular machines, such as WENDT, WAIDA, AGATHON, EWAG, COBORN, etc. AGATHON 400 PENTA 5-axis insert grinder is a fully automatic grinding center of the latest generation providing increased efficiency for insert production, the wheels used on AGATON are up to 400mm diameter. Which can grind most tool geometries with flexible clamping system. AGATHON laser machine can reduce the PCD processing time when make tool insert rough cutting, which can take place the rough grinding sometimes.
Resin bond centerless diamond wheels for grinding carbide, ceramic, magnetic materials, stainless steel bar, PCD & PCBN compositives. Types of resin bond diamond wheels: 1A1 , 6A1, 9A1
Resin bonded diamond grinding wheels applied to coarse grinding and finish grinding for metal materials, such as PCD and PCBN workpiece and tools, high speed steel, high vanadium steel, stainless steel, steel and hard alloy. For finishing grinding, polishing and ultra-finish grinding stage processing nonmetallic hard and brittle materials such as glass, stone, ceramics, gem, magnetic, etc.
Silicon wafer back grinding, resin bond diamond wheels are used for back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer
► Application: grinding carbide, ceramic, magnetic materials, stainless steel bar, PCD & PCBN compositives ► Model: 1A1 , 6A1, 9A1 ► Bonded Type: Resin bond, Metal bond ► Centerless Grinder Machine: Koyo, Crystec, Dedtru, Landis , Okuma, Paragon, Royal Master, Unison, WMV
Resin bond diamond wheel for silicon wafer can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.
Resin diamond grinding wheels are widely used in semi-precision grinding, fine grinding and polishing of cemented carbide tools, PDC cutter, PDC drill bits, ceramics, magnetic materials, crystals and face of quartz, etc
