Resin Bond diamond wheels are mostly used for precision grinding of cemented carbide, cermets and ceramics. Because of the bond elasticity, they are used for finish grinding of silicon, glass, ceramic-made electrical parts, etc. which require excellent surface finish. Resin bond wheels are suitable for grinding ferrous metals such as cast iron, high speed steels, and sintered iron. They are suitable for processing hard to machine materials because CBN grains are much stronger than conventional abrasives.
Silicon wafer back grinding, resin bond diamond wheels are used for back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer
►Excellent Grinding Action ►less apt to experience loading, and they dress easily for added convenience ►Convenience and Ease of Use ►Grinding abilities apply to both wet and dry tasks on processing objects such as harden steel, glass, ceramic, carbide alloys, ferrite, refractories, semi conductors, and other electrical carbon products.
Resin diamond grinding discs, diamond lapping discs are used for polishing and faceting gemstones (jade, crystal, agate), spinel, sapphire, jewellery, glass artwork and precision machining industry
Manufacturing processes for silicon semicond Silicon Ingot ⇒ Cropping(electroplated bandsaw) ⇒ Cylindrical / Flat Grinding Silicon Rod ⇒ Ingot Silicon (diamond wire) ⇒ Lapping (double side wheel/polishing pad) ⇒ Edge Grinding ⇒ Surface grinding ⇒ polishing⇒ wafer⇒ patterning ⇒ back grinding (vitrified / resin wheels) ⇒ dicing (dicing blades)⇒ chips ⇒ molding ⇒ packaging Moresuperhard provides a full range of silicon wafer grinding solution and service.
► Application: precision grinding micro drill tools Advantages of micro tool grinding wheel: * Good edge stability * High cutting efficiency * Minimal reject-part rates * Good round tool quality
Peripheral Diamond Grinding wheels for indexable inserts, must be of a high level of geometrical accuracy, with ability of significant material removal. We are able to produce various types wheels to suit all popular machines, such as WENDT, WAIDA, AGATHON, EWAG, COBORN, etc.
► OD cylindrical grinding wheel (1A1 shape) ► Diamond sanding belts ► Diamond internal grinding wheel ► Diamond honing stone Model: 1A1 diamond wheel (diameter up to 1100mm)
Resin diamond & cbn wheels used for machining tungsten carbide cutting tools, ceramic ,magnetic materials, silicon ,glass ,quartz and high speed steel,etc
Resin bonded diamond grinding wheels for peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat. Materials used in semiconductors and electronics parts, automobiles and photovoltaic industry. Types of these materials are varied including silicon, sapphire, and gallium arsenide (GaAs).
Micro precision resin diamond wheel has a good polishing effect. The Micro precision resin diamond wheel is sharp and not easy to be blocked during grinding. The specific characteristics are as follows: 1. The grinding efficiency is high, and the grinding wheel consumption is relatively slow; 2. Good self-sharpening, low heat generation during grinding, not easy to block, reducing the phenomenon of work burns during grinding; 3. The Micro precision resin diamond wheel has a certain degree of elasticity, which is beneficial to improve the surface roughness of the workpiece. It is mainly used for fine grinding, semi-finishing grinding, knife grinding, polishing and other processes
► Application: grinding carbide, ceramic, magnetic materials, stainless steel bar, PCD & PCBN compositives ► Model: 1A1 , 6A1, 9A1 ► Bonded Type: Resin bond, Metal bond ► Centerless Grinder Machine: Koyo, Crystec, Dedtru, Landis , Okuma, Paragon, Royal Master, Unison, WMV
We provide a full range of thermal spray coating solutions and services which includes: ► OD cylindrical grinding wheel (1A1 shape) ► Diamond sanding belts ► Diamond internal grinding wheel ► Diamond honing stone Model: 1A1 diamond wheel (diameter up to 1100mm)
► Application: grinding carbide and HSS. (such as drill, end mill, reamer) ► A complete solution for CNC tools manufacturing: fluting, gashing and Clear edge, relief angle grinding, OD grinding ► Model: 1A1, 1V1, 11V9, 12V9, 14A1, 12V5, etc
High Precision optical profile grinding wheels are used for profile grinding punching, grinding and slotting of precision tungsten steel parts, USB, IC, LED and other accessories, long product life, strong cutting force, and improve work efficiency. Optical profile grinders: WAIDA, WASINO and other projection optical machine
Resin bond diamond & CBN wheels are mainly used for small-diameter tungsten, stainless steel or hss drills, micro drills, and end mills used in electronics, medical technology, and the automotive industry. Advantages of micro tool grinding wheel: * Good edge stability * High cutting efficiency * Minimal reject-part rates * Good round tool quality
Resin diamond grinding wheels for peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat
► Bonded: resin bonded ► Application: precision grinding micro drill tools Advantages of micro tool grinding wheel: * Good edge stability * High cutting efficiency * Minimal reject-part rates * Good round tool quality
► Application: precise grinding mould and die, punch pin, optical grinding and form grinding cutting tool ( such as end mill and reamer) and precise instrument ► Model: 3A1, 14K1, 1B9 ► Bonded: resin bond & metal bond ► Optical Profile Grinder: Amada, Waida, Wasion, etc
