High Precision optical profile grinding wheels

Resin diamond & cbn wheels used for machining tungsten carbide cutting tools, ceramic ,magnetic materials, silicon, glass, quartz and high speed steel, etc

High Precision Resin diamond grinding wheels are widely used in semi-precision grinding, fine grinding and polishing of cemented carbide tools, PDC cutter, PDC drill bits, ceramics, magnetic materials, crystals and other materials.
Size of resin bonded diamond wheel: D60* 12.7* 19* 10MM

Resin diamond & cbn wheels used for machining tungsten carbide cutting tools, ceramic ,magnetic materials, silicon ,glass ,quartz and high speed steel,etc

► Application: precise grinding mould and die, punch pin, optical grinding and form grinding cutting tool ( such as end mill and reamer) and precise instrument
► Model: 1A1, 3A1, 14A1, 1V1, 11V9, 12V9, 4B1, 3A1, 14K1, 1B9
► Bonded: resin bond & metal bond
► Optical Profile Grinder: Amada, Waida, Wasion, etc

Resin bonded diamond grinding wheels for peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat.
Materials used in semiconductors and electronics parts, automobiles and photovoltaic industry. Types of these materials are varied including silicon, sapphire, and gallium arsenide (GaAs).

Resin diamond grinding wheels are widely used in cylindrical grinding semi-precision grinding, fine grinding and polishing of cemented carbide tools, PDC cutter, PDC drill bits, ceramics, magnetic materials, crystals and other materials

►Excellent Grinding Action
►less apt to experience loading, and they dress easily for added convenience
►Convenience and Ease of Use
►Grinding abilities apply to both wet and dry tasks on processing objects such as harden steel, glass, ceramic, carbide alloys, ferrite, refractories, semi conductors, and other electrical carbon products.

► Application: grinding carbide, ceramic, magnetic materials, stainless steel bar, PCD & PCBN compositives
► Model: 1A1 , 6A1, 9A1
► Bonded Type: Resin bond, Metal bond
► Centerless Grinder Machine: Koyo, Crystec, Dedtru, Landis , Okuma, Paragon, Royal Master, Unison, WMV

Resin bonded diamond wheels are mainly used for grinding carbide, non-metallic material, crispy hard alloy, non-metallic mineral, such as carbide, ceramic, agate, silicon,magnetic,self-fluxing alloy material,PCD & PCDN, wear resistant cast iron, stone materials 

Resin diamond grinding wheels are mainly used for grinding hard and brittle materials such as tungsten steel industry, cemented carbide industry, woodworking tool industry and die steel.
Rough grinding: 80# 100# 120#
Semi-finishing processing: 150# 180# 200# 240#
Fine grinding processing: 280# 320# 400# 500# 600# 800# 1000# 2000#

Resin cbn wheels are suitable for processing hard to machine materials because CBN grains are much stronger than conventional abrasives.

► Application: harder alloys, ceramics and cermet.
► Bonded: resin bond

Resin Diamond Wheel for PDC Cutter / Drill Bits Grinding.
Resin bond diamond wheel is widely used in semi-precision grinding, fine grinding and polishing of cemented carbide, pdc composite sheet, PDC drill bits, ceramics, magnetic materials, crystals and other materials.

Resin bond diamond flat wheels has high hardness, high strength and strong grinding ability.
Resin bond diamond wheels are mainly used for flat cylindrical, surface grinding high and hard alloys, non-metallic materials, cutting hard and brittle hard alloys, and non-metallic minerals.
Such as cemented carbide, ceramics, agate, optical glass, semiconductor materials, wear-resistant cast iron, stone, etc.

Hob cutter can be used for machining gears, sprockets, turbines and splines.
The material of gear hob cutter is divided into: hard alloy and high speed steel. (above HRC60)
Forming and grinding of high speed steel (hss) gear hob and thread cutting tools

► Application: precision grinding micro drill tools
Advantages of micro tool grinding wheel:
* Good edge stability
* High cutting efficiency
* Minimal reject-part rates
* Good round tool quality

Micro precision resin diamond wheel has a good polishing effect. The Micro precision resin diamond wheel is sharp and not easy to be blocked during grinding. The specific characteristics are as follows:
1. The grinding efficiency is high, and the grinding wheel consumption is relatively slow;
2. Good self-sharpening, low heat generation during grinding, not easy to block, reducing the phenomenon of work burns during grinding;
3. The Micro precision resin diamond wheel has a certain degree of elasticity, which is beneficial to improve the surface roughness of the workpiece. It is mainly used for fine grinding, semi-finishing grinding, knife grinding, polishing and other processes

Resin bond diamond & CBN wheels are mainly used for small-diameter tungsten, stainless steel or hss drills, micro drills, and end mills used in electronics, medical technology, and the automotive industry.
Advantages of micro tool grinding wheel:
* Good edge stability
* High cutting efficiency
* Minimal reject-part rates
* Good round tool quality

► Application: grinding carbide and HSS. (such as drill, end mill, reamer)
► A complete solution for CNC tools manufacturing: fluting, gashing and Clear edge, relief angle grinding, OD grinding
► Model: 1A1, 1V1, 11V9, 12V9, 14A1, 12V5, etc

Manufacturing processes for silicon semicond
Silicon Ingot ⇒ Cropping(electroplated bandsaw) ⇒ Cylindrical / Flat Grinding Silicon Rod ⇒ Ingot Silicon (diamond wire) ⇒ Lapping (double side wheel/polishing pad) ⇒ Edge Grinding ⇒ Surface grinding ⇒ polishing⇒ wafer⇒ patterning ⇒ back grinding (vitrified / resin wheels) ⇒ dicing (dicing blades)⇒ chips ⇒ molding ⇒ packaging
Moresuperhard provides a full range of silicon wafer grinding solution and service.

►Excellent Grinding Action
►less apt to experience loading, and they dress easily for added convenience
►Convenience and Ease of Use
►Grinding abilities apply to both wet and dry tasks on processing objects such as harden steel, glass, ceramic, carbide alloys, ferrite, refractories, semi conductors, and other electrical carbon products.

Types of resin bond diamond and cbn wheels: 1A1,1V1,1A1R,6A2,6A9,3A1,9A1,11V9,12A2,14A1 etc.   
Diameters: 25mm-500mm
Thickness:  5mm-40mm
Grit: 80# -5000# (D251-D1)
Hole: 10mm-127mm
Concentration: 25%, 50%, 75%, 100%, 125%, 150%

► Application: grinding carbide, ceramic, magnetic materials, stainless steel bar, PCD & PCBN compositives
► Model: 1A1 , 6A1, 9A1
► Bonded Type: Resin bond, Metal bond
► Centerless Grinder Machine: Koyo, Crystec, Dedtru, Landis , Okuma, Paragon, Royal Master, Unison, WMV

Diamond grinding wheel resinoid bonded is mainly used for grinding high and hard alloys, non-metallic materials, cutting hard and brittle hard alloys, non-metallic minerals, etc. Such as cemented carbide, ceramics, agate, optical glass, semiconductor materials, wear-resistant cast iron, stone, etc.

Resin bond diamond wheel for silicon wafer can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.