Resin diamond grinding wheels are mainly used for grinding hard and brittle materials such as tungsten steel industry, cemented carbide industry, woodworking tool industry and die steel. Rough grinding: 80# 100# 120# Semi-finishing processing: 150# 180# 200# 240# Fine grinding processing: 280# 320# 400# 500# 600# 800# 1000# 2000#
What Types of internal grinding wheels do we have? * vitrified CBN internal grinding wheel * resin diamond & CBN internal wheel * electroplated diamond mounted points * abrasive internal grinding wheel
resin diamond centreless (centerless) grinding wheels can perform excellent roundness of the work piece.The workpiece is supported by a work rest blade and set between a rubber regulating wheel that rotates the workpiece and a rotating grinding wheel
►Excellent Grinding Action ►less apt to experience loading, and they dress easily for added convenience ►Convenience and Ease of Use ►Grinding abilities apply to both wet and dry tasks on processing objects such as harden steel, glass, ceramic, carbide alloys, ferrite, refractories, semi conductors, and other electrical carbon products.
Hob cutter can be used for machining gears, sprockets, turbines and splines. The advantages of gear hob cutter grinding cbn wheel Grinding wheel uses end grinding, the outer circle is very thin, can be ground to the bottom of the edge. good wear resistance and low loss dry grinding and wet grinding.
Model: 4V9, 4BT9, 4V4, 14EE1 Bonded: resin bond, metal bond Application of cbn grinding wheels: forming and grinding of high speed steel (hss) gear hob and thread cutting tools Width of CBN wheel abrasive layer is generally 3mm -5mm, and the thickness is between 2mm
Peripheral Diamond Grinding wheels for indexable inserts, must be of a high level of geometrical accuracy, with ability of significant material removal. We are able to produce various types wheels to suit all popular machines, such as WENDT, WAIDA, AGATHON, EWAG, COBORN, etc.
The bakc grinding wheels include vitrified bond and resin bond diamond wheels. Application of back grinding wheels: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer
Hob cutter can be used for machining gears, sprockets, turbines and splines. The material of gear hob cutter is divided into: hard alloy and high speed steel. (above HRC60) Forming and grinding of high speed steel (hss) gear hob and thread cutting tools
Resin diamond & cbn wheels used for machining tungsten carbide cutting tools, ceramic ,magnetic materials, silicon ,glass ,quartz and high speed steel,etc
Resin diamond grinding wheels are widely used in semi-precision grinding, fine grinding and polishing of cemented carbide tools, PDC cutter, PDC drill bits, ceramics, magnetic materials, crystals and face of quartz, etc
What is a PG grinding wheel/optical profile grinder grinding wheel? Optical profile grinder processing must be equipped with a plotter. After drawing the shape sample of the workpiece to be formed, it is enlarged 20 times or 50 times, and then it is made into a film and pasted on the projection screen and processed according to the drawing. Bonded: resin bond and metal bond grinding wheel
High Precision Resin diamond grinding wheels are widely used in semi-precision grinding, fine grinding and polishing of cemented carbide tools, PDC cutter, PDC drill bits, ceramics, magnetic materials, crystals and other materials. Size of resin bonded diamond wheel: D60* 12.7* 19* 10MM
Resin Bond diamond wheels are mostly used for precision grinding, surface grinding, centerless grinding, cylindrical grinding, internal grinding of carbide, cermets and ceramics, glass, magnetic materials, quartz glass, etc. Size of resin diamond wheel: 60mmx 12.7mm x 19mm x 10mm
► Model: 1A1R, 1A1, 3A1, 1V1, 4A2, 4BT9, 6A2, 11V9, 12A2, 14F, etc ► Workpiece Materials: grinding tungsten carbide cutting tools, ceramic , magnetic materials, silicon , sapphire, glass , quartz and HVOF carbide coated,PCD, PCBN, etc ► Applicable Industry: carbide inserts (cnc tools), carbide circular saw (woodworking tools), Thermal Spraying Coated, Silicon Wafer Grinding, etc
Resin bond diamond flat wheels has high hardness, high strength and strong grinding ability. Resin bond diamond wheels are mainly used for flat cylindrical, surface grinding high and hard alloys, non-metallic materials, cutting hard and brittle hard alloys, and non-metallic minerals. Such as cemented carbide, ceramics, agate, optical glass, semiconductor materials, wear-resistant cast iron, stone, etc.
Resin diamond peripheral wheel is mainly used for the peripheral grinding of indexable blade, plane cutter, milling , cutting blade, welding blade, machine clip blade, carbide, ceramics, cermets, PCD, CBN, etc Including the grinding of end face, radius and relief angle.
Resin diamond grinding wheels for grinding carbide, cemented carbide, ceramics, agate, optical glass, semiconductor materials, wear-resistant cast iron, stone, etc. Type: flat, dish, cup Grinding: surface grinding, centerless grinding, cylindrical grinding, internal grinding Model: 1a1, 1a2, 6a2, 11v9, 14a1, 14f1, etc
We provide a full range of thermal spray coating solutions and services which includes: ► OD cylindrical grinding wheel (1A1 shape) ► Diamond sanding belts ► Diamond internal grinding wheel ► Diamond honing stone Model: 1A1 diamond wheel (diameter up to 1100mm)
► Application: harder alloys, ceramics and cermet. ► Bonded: resin bond
Resin bonded diamond grinding wheels for peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat. Materials used in semiconductors and electronics parts, automobiles and photovoltaic industry. Types of these materials are varied including silicon, sapphire, and gallium arsenide (GaAs).
► Bonded: resin bonded ► Application: precision grinding micro drill tools Advantages of micro tool grinding wheel: * Good edge stability * High cutting efficiency * Minimal reject-part rates * Good round tool quality
Manufacturing processes for silicon semicond Silicon Ingot ⇒ Cropping(electroplated bandsaw) ⇒ Cylindrical / Flat Grinding Silicon Rod ⇒ Ingot Silicon (diamond wire) ⇒ Lapping (double side wheel/polishing pad) ⇒ Edge Grinding ⇒ Surface grinding ⇒ polishing⇒ wafer⇒ patterning ⇒ back grinding (vitrified / resin wheels) ⇒ dicing (dicing blades)⇒ chips ⇒ molding ⇒ packaging Moresuperhard provides a full range of silicon wafer grinding solution and service.
Optical glass, electronic materials, and electronics industry. Glass chips on the side of EP wheels for glass polishing are removed and the glass is effectively removed to increase the strength of the glass. Especially our products are excellent in grinding efficiency, making various shapes . The optical profile wheels which are widely used in the processing and grinding of optical projection curve grinder or other precision grinders.
