Resibond diamond wheel for cylindrical grinding

High Precision Resin diamond grinding wheels are widely used in semi-precision grinding, fine grinding and polishing of cemented carbide tools, PDC cutter, PDC drill bits, ceramics, magnetic materials, crystals and other materials.
Size of resin bonded diamond wheel: D60* 12.7* 19* 10MM

► Application: grinding carbide, ceramic, magnetic materials, stainless steel bar, PCD & PCBN compositives
► Model: 1A1 , 6A1, 9A1
► Bonded Type: Resin bond, Metal bond
► Centerless Grinder Machine: Koyo, Crystec, Dedtru, Landis , Okuma, Paragon, Royal Master, Unison, WMV

Resin diamond grinding wheels are mainly used for grinding hard and brittle materials such as tungsten steel industry, cemented carbide industry, woodworking tool industry and die steel.
Rough grinding: 80# 100# 120#
Semi-finishing processing: 150# 180# 200# 240#
Fine grinding processing: 280# 320# 400# 500# 600# 800# 1000# 2000#

Manufacturing processes for silicon semicond
Silicon Ingot ⇒ Cropping(electroplated bandsaw) ⇒ Cylindrical / Flat Grinding Silicon Rod ⇒ Ingot Silicon (diamond wire) ⇒ Lapping (double side wheel/polishing pad) ⇒ Edge Grinding ⇒ Surface grinding ⇒ polishing⇒ wafer⇒ patterning ⇒ back grinding (vitrified / resin wheels) ⇒ dicing (dicing blades)⇒ chips ⇒ molding ⇒ packaging
Moresuperhard provides a full range of silicon wafer grinding solution and service.

► Application: grinding carbide and HSS. (such as drill, end mill, reamer)
► A complete solution for CNC tools manufacturing: fluting, gashing and Clear edge, relief angle grinding, OD grinding
► Model: 1A1, 1V1, 11V9, 12V9, 14A1, 12V5, etc

Resin bonded diamond grinding wheels applied to coarse grinding and finish grinding for metal materials, such as PCD and PCBN workpiece and tools, high speed steel, high vanadium steel, stainless steel, steel and hard alloy.
For finishing grinding, polishing and ultra-finish grinding stage processing nonmetallic hard and brittle materials such as glass, stone, ceramics, gem, magnetic, etc.

► Bonded: resin bonded
► Application: precision grinding micro drill tools
Advantages of micro tool grinding wheel:
* Good edge stability
* High cutting efficiency
* Minimal reject-part rates
* Good round tool quality

Resin diamond & cbn wheels used for machining tungsten carbide cutting tools, ceramic ,magnetic materials, silicon, glass, quartz and high speed steel, etc

Resin bond diamond cylindrical grinding wheels for the oil and gas industry, providing precise solutions for resin bond diamond cylindrical grinding wheel for PCD/carbide, wear parts and gage blocks for oil & gas drill manufacturing.

Resin bond cbn wheels are widely applied for asferrous materials such as high-speed steels and sintered ferrous metals

According to the bond, diamond grinding wheels can be divided into: resin bond diamond grinding wheels; ceramic bond diamond grinding wheels; metal bond diamond grinding wheels (bronze bond diamond grinding wheels)
Resin diamond grinding wheels are used for grinding and processing hard and brittle materials and metal materials such as carbide, glass, ceramics, ferrite, semiconductor materials, stone, etc.

Peripheral Diamond Grinding wheels for indexable inserts, must be of a high level of geometrical accuracy, with ability of significant material removal. We are able to produce various types wheels to suit all popular machines, such as WENDT, WAIDA, AGATHON, EWAG, COBORN, etc.
AGATHON 400 PENTA 5-axis insert grinder is a fully automatic grinding center of the latest generation providing increased efficiency for insert production, the wheels used on AGATON are up to 400mm diameter. Which can grind most tool geometries with flexible clamping system. AGATHON laser machine can reduce the PCD processing time when make tool insert rough cutting, which can take place the rough grinding sometimes.

Type: 1A1 & 1A1R
Application: cutting tungsten carbide, alloys, quartz, ceramics, glass, carbon fibre composites, fiber glass, HSS, Hardened Steel and other ferrous material.

Resin bond grinding wheels are the most commonly used super abrasive product currently. our resin diamond wheel is suitable for surface grinding, OD grinding, centerless grinding, tool grinding, fine grinding ,double disc grinding and slot grinding of most precision workpieces.

► Model: 1A1R, 1A1, 3A1, 1V1, 4A2, 4BT9, 6A2, 11V9, 12A2, 14F, etc
► Workpiece Materials: grinding tungsten carbide cutting tools, ceramic , magnetic materials, silicon , sapphire, glass , quartz and HVOF carbide coated,PCD, PCBN, etc
► Applicable Industry: carbide inserts (cnc tools), carbide circular saw (woodworking tools), Thermal Spraying Coated, Silicon Wafer Grinding, etc

Resin diamond grinding wheels for peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat

► Model: 1A1R, 1A1, 3A1, 1V1, 4A2, 4BT9, 6A2, 11V9, 12A2, 14F, etc
► Workpiece Materials: grinding tungsten carbide cutting tools, ceramic , magnetic materials, silicon , sapphire, glass , quartz and HVOF carbide coated,PCD, PCBN, etc
► Applicable Industry: carbide inserts (cnc tools), carbide circular saw (woodworking tools), Thermal Spraying Coated, Silicon Wafer Grinding, etc

We provide a full range of thermal spray coating solutions and services which includes:
► OD cylindrical grinding wheel (1A1 shape)
► Diamond sanding belts
► Diamond internal grinding wheel
► Diamond honing stone
Model: 1A1 diamond wheel (diameter up to 1100mm)

Resin bond diamond wheel for silicon wafer can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.

Silicon wafer back grinding, resin bond diamond wheels are used for back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer

► Application: precise grinding mould and die, punch pin, optical grinding and form grinding cutting tool ( such as end mill and reamer) and precise instrument
► Model: 3A1, 14K1, 1B9
► Bonded: resin bond & metal bond
► Optical Profile Grinder: Amada, Waida, Wasion, etc

— Applications: face grinding, top grinding, flank grinding, hollow tooth grinding and re-sharpening for tungsten carbide tipped saw blades and one-piece HSS saws
— Models: 4A2, 4BT9, 11A2, 15A2, 12V2, 14F1, etc
— Bonded: Resin bond, vitrified bond
— Grinding Machine: Vollmer, Woodtronic, Akemat, Widma and so on

Resin bonded diamond grinding wheels are used for finishing grinding, polishing and ultra-finish grinding stage processing nonmetallic hard and brittle materials such as glass, stone, ceramics, gem, magnetic, etc.

► Bonded: resin bonded
► Application: precision grinding micro drill tools
Advantages of micro tool grinding wheel:
* Good edge stability
* High cutting efficiency
* Minimal reject-part rates
* Good round tool quality

►Excellent Grinding Action
►less apt to experience loading, and they dress easily for added convenience
►Convenience and Ease of Use
►Grinding abilities apply to both wet and dry tasks on processing objects such as harden steel, glass, ceramic, carbide alloys, ferrite, refractories, semi conductors, and other electrical carbon products.

Resin diamond peripheral wheel is mainly used for the peripheral grinding of indexable blade, plane cutter, milling , cutting blade, welding blade, machine clip blade, carbide, ceramics, cermets, PCD, CBN, etc
Including the grinding of end face, radius and relief angle.

Moresuperhard provides the silicon ingot grinding solution and service.
Our resin bond diamond wheels for peripheral grinding of silicon ingots