Resin bonding diamond grinding wheels are mainly used for grinding tungsten carbide and non-metal materials. Various kinds of dimensions and shapes are available, such as flat shapes, cup shapes and dish shapes, etc. Size of resin diamond wheel: 165D * 7X* 28T* 32H B80
► Application: grinding carbide, ceramic, magnetic materials, stainless steel bar, PCD & PCBN compositives ► Model: 1A1 , 6A1, 9A1 ► Bonded Type: Resin bond, Metal bond ► Centerless Grinder Machine: Koyo, Crystec, Dedtru, Landis , Okuma, Paragon, Royal Master, Unison, WMV
► Model: 1A1R, 1A1, 3A1, 1V1, 4A2, 4BT9, 6A2, 11V9, 12A2, 14F, etc ► Workpiece Materials: grinding tungsten carbide cutting tools, ceramic , magnetic materials, silicon , sapphire, glass , quartz and HVOF carbide coated,PCD, PCBN, etc ► Applicable Industry: carbide inserts (cnc tools), carbide circular saw (woodworking tools), Thermal Spraying Coated, Silicon Wafer Grinding, etc
Moresuperhard provides qualified services For DANOBAT Precision Grinding Machines. Centerless grinding models：VG, DVG
► Resind diamond/CBN grinding wheels ► Conventional grinding wheels ► Diamond dressing wheels
Resin diamond grinding wheels are mainly used for grinding hard and brittle materials such as tungsten steel industry, cemented carbide industry, woodworking tool industry and die steel. Rough grinding: 80# 100# 120# Semi-finishing processing: 150# 180# 200# 240# Fine grinding processing: 280# 320# 400# 500# 600# 800# 1000# 2000#
We provide a full range of thermal spray coating solutions and services which includes: ► OD cylindrical grinding wheel (1A1 shape) ► Diamond sanding belts ► Diamond internal grinding wheel ► Diamond honing stone Model: 1A1 diamond wheel (diameter up to 1100mm)
Silicon wafer back grinding, resin bond diamond wheels are used for back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer
► Application: precision grinding micro drill tools Advantages of micro tool grinding wheel: * Good edge stability * High cutting efficiency * Minimal reject-part rates * Good round tool quality
Diamond CBN grinding wheel heads are used because of their durability and their ability to cleanly cut the harder alloys, ceramics and cermet.
Resin diamond grinding wheels for grinding carbide, cemented carbide, ceramics, agate, optical glass, semiconductor materials, wear-resistant cast iron, stone, etc. Type: flat, dish, cup Grinding: surface grinding, centerless grinding, cylindrical grinding, internal grinding Model: 1a1, 1a2, 6a2, 11v9, 14a1, 14f1, etc
Resin diamond peripheral wheel is mainly used for the peripheral grinding of indexable blade, plane cutter, milling , cutting blade, welding blade, machine clip blade, carbide, ceramics, cermets, PCD, CBN, etc Including the grinding of end face, radius and relief angle.
Resin bond diamond wheel is solidified at low temperature, the production cycle is short, and the equipment and supply process are relatively simple; because the resin has fluidity, it is easy to form a grinding wheel with a complex surface.
►Excellent Grinding Action ►less apt to experience loading, and they dress easily for added convenience ►Convenience and Ease of Use ►Grinding abilities apply to both wet and dry tasks on processing objects such as harden steel, glass, ceramic, carbide alloys, ferrite, refractories, semi conductors, and other electrical carbon products.
Resinoid bond diamond cbn grinding wheels are used For finishing grinding, polishing and ultra-finish grinding stage processing nonmetallic hard and brittle materials such as glass, stone, ceramics, gem, magnetic, etc. Various kinds of dimensions and shapes are available, such as flat shapes, cup shapes and dish shapes, etc.
Manufacturing processes for silicon semicond Silicon Ingot ⇒ Cropping(electroplated bandsaw) ⇒ Cylindrical / Flat Grinding Silicon Rod ⇒ Ingot Silicon (diamond wire) ⇒ Lapping (double side wheel/polishing pad) ⇒ Edge Grinding ⇒ Surface grinding ⇒ polishing⇒ wafer⇒ patterning ⇒ back grinding (vitrified / resin wheels) ⇒ dicing (dicing blades)⇒ chips ⇒ molding ⇒ packaging Moresuperhard provides a full range of silicon wafer grinding solution and service.
Resin Bond diamond wheels are mostly used for precision grinding of cemented carbide, cermets and ceramics.
Resin bond diamond flat wheels has high hardness, high strength and strong grinding ability. Resin bond diamond wheels are mainly used for flat cylindrical, surface grinding high and hard alloys, non-metallic materials, cutting hard and brittle hard alloys, and non-metallic minerals. Such as cemented carbide, ceramics, agate, optical glass, semiconductor materials, wear-resistant cast iron, stone, etc.
Resin bonded diamond grinding wheels applied to coarse grinding and finish grinding for metal materials, such as PCD and PCBN workpiece and tools, high speed steel, high vanadium steel, stainless steel, steel and hard alloy. For finishing grinding, polishing and ultra-finish grinding stage processing nonmetallic hard and brittle materials such as glass, stone, ceramics, gem, magnetic, etc.
Type: 1A1 & 1A1R Application: cutting tungsten carbide, alloys, quartz, ceramics, glass, carbon fibre composites, fiber glass, HSS, Hardened Steel and other ferrous material.
