resin disc diamond grinding wheel Chinese manufactuer

Diamond grinding wheel resinoid bonded is mainly used for grinding high and hard alloys, non-metallic materials, cutting hard and brittle hard alloys, non-metallic minerals, etc. Such as cemented carbide, ceramics, agate, optical glass, semiconductor materials, wear-resistant cast iron, stone, etc.

Types of resin bond diamond and cbn wheels: 1A1,1V1,1A1R,6A2,6A9,3A1,9A1,11V9,12A2,14A1 etc.   
Diameters: 25mm-500mm
Thickness:  5mm-40mm
Grit: 80# -5000# (D251-D1)
Hole: 10mm-127mm
Concentration: 25%, 50%, 75%, 100%, 125%, 150%

Resin Bond diamond wheels are mostly used for precision grinding of cemented carbide, cermets and ceramics.
Because of the bond elasticity, they are used for finish grinding of silicon, glass, ceramic-made electrical parts, etc. which require excellent surface finish.
Resin bond wheels are suitable for grinding ferrous metals such as cast iron, high speed steels, and sintered iron.
They are suitable for processing hard to machine materials because CBN grains are much stronger than conventional abrasives.

Resin bonded diamond wheels are mainly used for grinding carbide, non-metallic material, crispy hard alloy, non-metallic mineral, such as carbide, ceramic, agate, silicon,magnetic,self-fluxing alloy material,PCD & PCDN, wear resistant cast iron, stone materials 

Hob cutter can be used for machining gears, sprockets, turbines and splines.
The material of gear hob cutter is divided into: hard alloy and high speed steel. (above HRC60)
Forming and grinding of high speed steel (hss) gear hob and thread cutting tools

Resin bonded diamond grinding wheels applied to coarse grinding and finish grinding for metal materials, such as PCD and PCBN workpiece and tools, high speed steel, high vanadium steel, stainless steel, steel and hard alloy.
For finishing grinding, polishing and ultra-finish grinding stage processing nonmetallic hard and brittle materials such as glass, stone, ceramics, gem, magnetic, etc.

► Good concentricity, less runout, small tolerance
► Round hole/Face/Square hole/Arc/Groove/ Spherical/ contour grinding
► Bond: resin bond/ electroplated/ vitrified
► Grinding machine: Moore, Hauser, Mitsuiseiki, Waida and Jingtian, etc.
► Grit：40 #-1000#

► Application: carbide, tungsten steel, ceramic , optical glass, sapphire glass, high speed steel, bearing steel, tool steel, stainless steel and cast iron, etc
► Bond: vitrified bond & resin bond
► Diameter: 300- 1500mm

► Provide matching dressing grinding wheel
►Diamond & cbn shapes: cylindrical, hexagonal, square, segmented
► Grinding machines: Wendt WBM, Viotoo, AMT, Stahli, Peter Wolters, Diskus, Agathon T&B, Fujisanki, Supfina, Melchiorre, Koyo, Lam Plan, Speedfam, Kemet, Gardner and other brands.

Moresuperhard provides the silicon ingot grinding solution and service.
Our resin bond diamond wheels for peripheral grinding of silicon ingots

► Application: precise grinding mould and die, punch pin, optical grinding and form grinding cutting tool ( such as end mill and reamer) and precise instrument
► Model: 3A1, 14K1, 1B9
► Bonded: resin bond & metal bond
► Optical Profile Grinder: Amada, Waida, Wasion, etc

High Precision optical profile grinding wheels are used for profile grinding punching, grinding and slotting of precision tungsten steel parts, USB, IC, LED and other accessories, long product life, strong cutting force, and improve work efficiency.
Optical profile grinders: WAIDA, WASINO and other projection optical machine

Moresuperhard provides qualified services For DANOBAT Precision Grinding Machines.
Centerless grinding models：VG, DVG

► Resind diamond/CBN grinding wheels
► Conventional grinding wheels
► Diamond dressing wheels

►Excellent Grinding Action
►less apt to experience loading, and they dress easily for added convenience
►Convenience and Ease of Use
►Grinding abilities apply to both wet and dry tasks on processing objects such as harden steel, glass, ceramic, carbide alloys, ferrite, refractories, semi conductors, and other electrical carbon products.

► Model: 1A1R, 1A1, 3A1, 1V1, 4A2, 4BT9, 6A2, 11V9, 12A2, 14F, etc
► Workpiece Materials: grinding tungsten carbide cutting tools, ceramic , magnetic materials, silicon , sapphire, glass , quartz and HVOF carbide coated,PCD, PCBN, etc
► Applicable Industry: carbide inserts (cnc tools), carbide circular saw (woodworking tools), Thermal Spraying Coated, Silicon Wafer Grinding, etc

Resinoid bond diamond cbn grinding wheels are used For finishing grinding, polishing and ultra-finish grinding stage processing nonmetallic hard and brittle materials such as glass, stone, ceramics, gem, magnetic, etc.
Various kinds of dimensions and shapes are available, such as flat shapes, cup shapes and dish shapes, etc.

Resinoid bond diamond grinding wheel has good self-sharpening, elasticity and good polishing and grinding performance.
Resin diamond & cbn wheels used for grinding tungsten carbide, ceramic, magnetic materials, silicon, glass, quartz and high speed steel, etc

Optical glass, electronic materials, and electronics industry. Glass chips on the side of EP wheels for glass polishing are removed and the glass is effectively removed to increase the strength of the glass. Especially our products are excellent in grinding efficiency, making various shapes .
The optical profile wheels which are widely used in the processing and grinding of optical projection curve grinder or other precision grinders.

Resin Bond diamond wheels are mostly used for precision grinding, surface grinding, centerless grinding, cylindrical grinding, internal grinding of carbide, cermets and ceramics, glass, magnetic materials, quartz glass, etc.
Size of resin diamond wheel: 60mmx 12.7mm x 19mm x 10mm

Model: 4V9, 4BT9, 4V4, 14EE1
Bonded: resin bond, metal bond
Application of cbn grinding wheels: forming and grinding of high speed steel (hss) gear hob and thread cutting tools
Width of CBN wheel abrasive layer is generally 3mm -5mm, and the thickness is between 2mm

Micro precision resin diamond wheel has a good polishing effect. The Micro precision resin diamond wheel is sharp and not easy to be blocked during grinding. The specific characteristics are as follows:
1. The grinding efficiency is high, and the grinding wheel consumption is relatively slow;
2. Good self-sharpening, low heat generation during grinding, not easy to block, reducing the phenomenon of work burns during grinding;
3. The Micro precision resin diamond wheel has a certain degree of elasticity, which is beneficial to improve the surface roughness of the workpiece. It is mainly used for fine grinding, semi-finishing grinding, knife grinding, polishing and other processes

Resin diamond grinding discs, diamond lapping discs are used for polishing and faceting gemstones (jade, crystal, agate), spinel, sapphire, jewellery, glass artwork and precision machining industry

What are the characteristics of resin diamond grinding wheels?
Resin bond is an organic bond. The resin diamond grinding wheel manufactured by this bond has high strength, certain elasticity, low heat resistance, good self-sharpening, simple production, and short process cycle. It can manufacture grinding wheels with working speed higher than 50 m/s and very thin grinding wheels.

►Excellent Grinding Action
►less apt to experience loading, and they dress easily for added convenience
►Convenience and Ease of Use
►Grinding abilities apply to both wet and dry tasks on processing objects such as harden steel, glass, ceramic, carbide alloys, ferrite, refractories, semi conductors, and other electrical carbon products.

Resin bonding diamond grinding wheels are mainly used for grinding tungsten carbide and non-metal materials. Various kinds of dimensions and shapes are available, such as flat shapes, cup shapes and dish shapes, etc.
Size of resin diamond wheel: 165D * 7X* 28T* 32H B80

Resin diamond grinding wheels are widely used in cylindrical grinding semi-precision grinding, fine grinding and polishing of cemented carbide tools, PDC cutter, PDC drill bits, ceramics, magnetic materials, crystals and other materials

Silicon wafer back grinding, resin bond diamond wheels are used for back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer