► Application: grinding carbide and HSS. (such as drill, end mill, reamer) ► A complete solution for CNC tools manufacturing: fluting, gashing and Clear edge, relief angle grinding, OD grinding ► Model: 1A1, 1V1, 11V9, 12V9, 14A1, 12V5, etc
► Bonded: resin bonded ► Application: precision grinding micro drill tools Advantages of micro tool grinding wheel: * Good edge stability * High cutting efficiency * Minimal reject-part rates * Good round tool quality
— Applications: face grinding, top grinding, flank grinding, hollow tooth grinding and re-sharpening for tungsten carbide tipped saw blades and one-piece HSS saws — Models: 4A2, 4BT9, 11A2, 15A2, 12V2, 14F1, etc — Bonded: Resin bond, vitrified bond — Grinding Machine: Vollmer, Woodtronic, Akemat, Widma and so on
Resin diamond & cbn wheels used for machining tungsten carbide cutting tools, ceramic ,magnetic materials, silicon ,glass ,quartz and high speed steel,etc
Moresuperhard company’s diamond grinding wheel resinoid bonded can choose a variety of grinding wheels according to the product model: (Parallel grinding wheel, parallel arc grinding wheel, double-sided concave grinding wheel, double bevel grinding wheel, bowl-shaped grinding wheel, etc.)
Types of resin bond diamond and cbn wheels: 1A1,1V1,1A1R,6A2,6A9,3A1,9A1,11V9,12A2,14A1 etc. Diameters: 25mm-500mm Thickness: 5mm-40mm Grit: 80# -5000# (D251-D1) Hole: 10mm-127mm Concentration: 25%, 50%, 75%, 100%, 125%, 150%
Resin diamond grinding wheels are widely used in semi-precision grinding, fine grinding and polishing of cemented carbide tools, PDC cutter, PDC drill bits, ceramics, magnetic materials, crystals and face of quartz, etc
What are the characteristics of resin diamond grinding wheels? Resin bond is an organic bond. The resin diamond grinding wheel manufactured by this bond has high strength, certain elasticity, low heat resistance, good self-sharpening, simple production, and short process cycle. It can manufacture grinding wheels with working speed higher than 50 m/s and very thin grinding wheels.
The purpose of optical projection grinder PG grinding wheels 1. Curve or angle grinding is required for the workpiece to be tungsten steel or harder steel. 2. Those who have requirements for surface finish and clear angle. 3. The processing accuracy can reach 0.0002 or even 0.0001mm, which has become an indispensable processing method for modern industrial manufacturing. Common brands of optical projection grinders: 1. Japan WAIDA (24mm inner hole) 2. Japan WASINO (22.23mm inner hole) 3. German PETEWE (22mm inner hole) Optical projection grinding wheel
Resin diamond grinding wheels for peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat
According to the bond, diamond grinding wheels can be divided into: resin bond diamond grinding wheels; ceramic bond diamond grinding wheels; metal bond diamond grinding wheels (bronze bond diamond grinding wheels) Resin diamond grinding wheels are used for grinding and processing hard and brittle materials and metal materials such as carbide, glass, ceramics, ferrite, semiconductor materials, stone, etc.
►Excellent Grinding Action ►less apt to experience loading, and they dress easily for added convenience ►Convenience and Ease of Use ►Grinding abilities apply to both wet and dry tasks on processing objects such as harden steel, glass, ceramic, carbide alloys, ferrite, refractories, semi conductors, and other electrical carbon products.
Optical glass, electronic materials, and electronics industry. Glass chips on the side of EP wheels for glass polishing are removed and the glass is effectively removed to increase the strength of the glass. Especially our products are excellent in grinding efficiency, making various shapes . The optical profile wheels which are widely used in the processing and grinding of optical projection curve grinder or other precision grinders.
Resin diamond & cbn wheels used for machining tungsten carbide cutting tools, ceramic ,magnetic materials, silicon, glass, quartz and high speed steel, etc
The bakc grinding wheels include vitrified bond and resin bond diamond wheels. Application of back grinding wheels: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer
We provide a full range of thermal spray coating solutions and services which includes: ► OD cylindrical grinding wheel (1A1 shape) ► Diamond sanding belts ► Diamond internal grinding wheel ► Diamond honing stone Model: 1A1 diamond wheel (diameter up to 1100mm)
Diamond grinding wheel resinoid bonded for grinding tungsten carbide and HSS steel. Such as drills, end mills, reamers, micro drills, mini end mills and burrs, etc
Resin bonded diamond grinding wheels for peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat. Materials used in semiconductors and electronics parts, automobiles and photovoltaic industry. Types of these materials are varied including silicon, sapphire, and gallium arsenide (GaAs).
Resin diamond peripheral wheel is mainly used for the peripheral grinding of indexable blade, plane cutter, milling , cutting blade, welding blade, machine clip blade, carbide, ceramics, cermets, PCD, CBN, etc Including the grinding of end face, radius and relief angle.
Resin bond diamond mounted points are excellent tools for grinding small areas with diamond smoothing tools for making a clear polished surface finish. This tool has a unique quality that is recommendable for stone carving, cleaning up work, glass, ceramic, and metal. ► Application: harder alloys, ceramics and cermet. ► Bonded: resin bond
