►Excellent Grinding Action ►less apt to experience loading, and they dress easily for added convenience ►Convenience and Ease of Use ►Grinding abilities apply to both wet and dry tasks on processing objects such as harden steel, glass, ceramic, carbide alloys, ferrite, refractories, semi conductors, and other electrical carbon products.
Optical glass, electronic materials, and electronics industry. Glass chips on the side of EP wheels for glass polishing are removed and the glass is effectively removed to increase the strength of the glass. Especially our products are excellent in grinding efficiency, making various shapes . The optical profile wheels which are widely used in the processing and grinding of optical projection curve grinder or other precision grinders.
Diamond CBN grinding wheel heads are used because of their durability and their ability to cleanly cut the harder alloys, ceramics and cermet.
Resin CBN grinding wheels are specially used for hss gear hob cutter grinding. Models of resin cbn wheels: 4V9, 4BT9, 4V4, 14EE1 Bonded: resin bond, metal bond
Silicon wafer back grinding, resin bond diamond wheels are used for back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer
Resin diamond & cbn wheels used for machining tungsten carbide cutting tools, ceramic ,magnetic materials, silicon, glass, quartz and high speed steel, etc
Peripheral Diamond Grinding wheels for indexable inserts, must be of a high level of geometrical accuracy, with ability of significant material removal. We are able to produce various types wheels to suit all popular machines, such as WENDT, WAIDA, AGATHON, EWAG, COBORN, etc. AGATHON 400 PENTA 5-axis insert grinder is a fully automatic grinding center of the latest generation providing increased efficiency for insert production, the wheels used on AGATON are up to 400mm diameter. Which can grind most tool geometries with flexible clamping system. AGATHON laser machine can reduce the PCD processing time when make tool insert rough cutting, which can take place the rough grinding sometimes.
► Application: precise grinding mould and die, punch pin, optical grinding and form grinding cutting tool ( such as end mill and reamer) and precise instrument ► Model: 1A1, 3A1, 14A1, 1V1, 11V9, 12V9, 4B1, 3A1, 14K1, 1B9 ► Bonded: resin bond & metal bond ► Optical Profile Grinder: Amada, Waida, Wasion, etc
Diamond grinding wheel resinoid bonded for grinding tungsten carbide and HSS steel. Such as drills, end mills, reamers, micro drills, mini end mills and burrs, etc
► Model: 1A1R, 1A1, 3A1, 1V1, 4A2, 4BT9, 6A2, 11V9, 12A2, 14F, etc ► Workpiece Materials: grinding tungsten carbide cutting tools, ceramic , magnetic materials, silicon , sapphire, glass , quartz and HVOF carbide coated,PCD, PCBN, etc ► Applicable Industry: carbide inserts (cnc tools), carbide circular saw (woodworking tools), Thermal Spraying Coated, Silicon Wafer Grinding, etc
High Precision Resin diamond grinding wheels are widely used in semi-precision grinding, fine grinding and polishing of cemented carbide tools, PDC cutter, PDC drill bits, ceramics, magnetic materials, crystals and other materials. Size of resin bonded diamond wheel: D60* 12.7* 19* 10MM
Resin diamond & cbn wheels used for machining tungsten carbide cutting tools, ceramic ,magnetic materials, silicon ,glass ,quartz and high speed steel,etc
High Precision optical profile grinding wheels are used for profile grinding punching, grinding and slotting of precision tungsten steel parts, USB, IC, LED and other accessories, long product life, strong cutting force, and improve work efficiency. Optical profile grinders: WAIDA, WASINO and other projection optical machine
Resin bond diamond flat wheels has high hardness, high strength and strong grinding ability. Resin bond diamond wheels are mainly used for flat cylindrical, surface grinding high and hard alloys, non-metallic materials, cutting hard and brittle hard alloys, and non-metallic minerals. Such as cemented carbide, ceramics, agate, optical glass, semiconductor materials, wear-resistant cast iron, stone, etc.
Resin Bond diamond wheels are mostly used for precision grinding, surface grinding, centerless grinding, cylindrical grinding, internal grinding of carbide, cermets and ceramics, glass, magnetic materials, quartz glass, etc. Size of resin diamond wheel: 60mmx 12.7mm x 19mm x 10mm
► Application: precision grinding micro drill tools Advantages of micro tool grinding wheel: * Good edge stability * High cutting efficiency * Minimal reject-part rates * Good round tool quality
Manufacturing processes for silicon semicond Silicon Ingot ⇒ Cropping(electroplated bandsaw) ⇒ Cylindrical / Flat Grinding Silicon Rod ⇒ Ingot Silicon (diamond wire) ⇒ Lapping (double side wheel/polishing pad) ⇒ Edge Grinding ⇒ Surface grinding ⇒ polishing⇒ wafer⇒ patterning ⇒ back grinding (vitrified / resin wheels) ⇒ dicing (dicing blades)⇒ chips ⇒ molding ⇒ packaging Moresuperhard provides a full range of silicon wafer grinding solution and service.
► Application: precise grinding mould and die, punch pin, optical grinding and form grinding cutting tool ( such as end mill and reamer) and precise instrument ► Model: 3A1, 14K1, 1B9 ► Bonded: resin bond & metal bond ► Optical Profile Grinder: Amada, Waida, Wasion, etc
Resin diamond peripheral wheel is mainly used for the peripheral grinding of indexable blade, plane cutter, milling , cutting blade, welding blade, machine clip blade, carbide, ceramics, cermets, PCD, CBN, etc Including the grinding of end face, radius and relief angle.
Straight type resin diamond cbn wheels Model: 1A1R, 1A1, 3A1, 1V1, 4A2, 4BT9, 6A2, 11V9, 12A2, 14F, etc Workpiece Materials: grinding tungsten carbide cutting tools, ceramic , magnetic materials, silicon , sapphire, glass , quartz and HVOF carbide coated,PCD, PCBN, etc
