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silicion wafer
Nov 11, 2021
The chip is square while wafer is round?
hether in computers or mobile phones, chips are mostly made into squares. The main reasons for making them square rather than round are as follows:  
1. Circular chips waste a lot of scrap when cutting wafers, and make rectangles (rectangles include squares) to minimize the waste of scrap.  
2. The chip is a product with very high precision, in wafer cutting, straight cutting is the most convenient, arc cutting has high requirements for cutting tools, and the crystal core of monocrystalline silicon itself has direction, arc cutting is easy to cut the edge of the chip.  
3. The rectangular chip is more convenient for positioning during wiring and installation. If it is made into a circle, even a slight Angle deviation may lead to errors in wiring and installation due to the rotation symmetry of the circle at any Angle.  
4. Electronic products have a high degree of integration, and the circular chip is not conducive to the overall layout of the circuit board.  
die internal grinding
Nov 04, 2021
How to prevent die grinding damage
Die performance processing needs to go through a number of procedures, grinding is one of processes.  That is to use the method of forming grinding to punch, concave die and convex and concave die parts for finishing, is commonly used at present, is also very effective processing method.  The characteristics of forming grinding is called forming grinding, which is to decompose the complex forming surface into a number of simple surfaces, such as plane, cylinder, etc., and then segmented grinding, and make its connection smooth, rounded, so as to meet the requirements of the drawing.  
Different processing methods have different effects, such as the use of electrolytic grinding processing, improve mold manufacturing accuracy and surface quality.  In electrolytic grinding, the grinding wheel scrapes the oxide film instead of grinding metal, so the grinding force is small, the grinding heat is small, and there will be no grinding burrs, cracks, burns and other phenomena.
Engineer ceramic
Nov 03, 2021
How to grind engineer ceramics?
Diamond abrasive for grinding zirconia ceramics  
Zirconia ceramics are hard and brittle and difficult to work. Diamond abrasives are often used in grinding.  According to different bond, diamond grinding wheel can be divided into resin bond diamond sand, ceramic bond diamond grinding wheel and metal bond diamond grinding wheel.  
diamond sand belt
Nov 02, 2021
Grinding characteristics of diamond sanding belt in thermal spraying coating application
The hardness of high hardness thermal spraying coating such as super alloy and special ceramics is generally above 1000Hv0.2, the coating thickness is between 0.1mm and 0.5mm, and the thermal spraying layer is hard and thin. In the grinding process, due to the high hardness of the thermal spray coating, diamond abrasive tools are often used for processing. Diamond has a Mohs hardness of 10, which is the highest hardness material currently found. It is especially suitable for processing non-metallic and non-ferrous metal hard-to-process materials with high hardness and high brittleness.
Oct 30, 2021
Moresuperhard will attend The China cutting tools and Equipments Exhibition-2021
The China Cutting Tools and Equipments Exhibition-2021 will be held in Suzhou International Expo Center from November 2 to 4, 2021. This grand event is co-spons
Oct 30, 2021
Aerospace industry parts grinding
The final aerodynamic performance and fatigue life of aeroengine blade are determined by the profile accuracy and surface quality.  As the final material removal process of aero-engine blade, grinding directly affects the final mechanical properties and surface state of blade.  
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