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back grinding wheel for silicon wafer
back grinding wheel for silicon wafer
back grinding wheel for silicon wafer
back grinding wheel for silicon wafer
back grinding wheel for silicon wafer
back grinding wheel for silicon wafer

Back Grinding Wheel for Silicon Wafer

► Application of back grinding wheels: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer

► Grinding Machines: Okamoto , Disco, TSK and STRASBAUGH, etc

► Bonded: Vitrified bond, Resin bond

► Diameter (mm): D175, D195, D209, D305, D335, etc


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silicon wafer back grinding

Manufacturing Processes for Silicon Wafers
Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips......
 

Applications of back grinding wheel
Back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
silicon wafer back grinding

Applicable Grinding Machine
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.

Specifications of silicon wafer back grinding


6A2T
Model D (mm) T (mm) H (mm)

6A2/6A2H
175 30, 35 76
200 35 76
350 45 127

6A2T
195 22.5, 25 170
280 30 228.6

6A2T(three ellipses)
350 35 235
209 22.5 158
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