silicon wafer grinding

Resin/virtified/metal bond diamond wheel for silicon wafer can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.

Diamond Polishing Paste is divided into water-soluble polishing paste and oil-soluble polishing paste
Package of polishing paste: injector, bag or box
Spect: 5g、10g、30g、100g and so on
Diamond size of polishing pase: W0.25 W0.5 W1 W1.5 W2.5 W3.5 W5 W7 W10 W14 W20 W28 W40
Moresuperhard can also provide various of grain size diamond polishing paste according to users’ requirement and we can also provide CBN polishing paste

Moresuperhard can also provide various grain size diamond polishing compound according to users’ requirement and we can also provide CBN polishing compound

Diamond polishing compound for polishing
Grinding and polishing of precision ceramics, magnetic materials, magnetic heads, iron hydrochloride, cemented carbide
Fine grinding of metallographic and petrographic samples of high-hardness materials, etc.
Precision medical equipment, dental materials (dentures) grinding and polishing
Diamond polishing compound has better lubrication and cooling performance, high grinding efficiency, good surface processing quality, better finish, easy to use, etc.

Diamond Polishing Paste, Diamond Compound is divided into water-soluble polishing paste and oil-soluble polishing paste
Package: injector, bag or box
Spect: 5g、10g、30g、100g and so on
Diamond size of polishing pase: W0.25 W0.5 W1 W1.5 W2.5 W3.5 W5 W7 W10 W14 W20 W28 W40
Moresuperhard can also provide special products according to users’ requirement and we can also provide CBN polishing paste, CBN compound

Manufacturing processes for silicon semicond
Silicon Ingot ⇒ Cropping(electroplated bandsaw) ⇒ Cylindrical / Flat Grinding Silicon Rod ⇒ Ingot Silicon (diamond wire) ⇒ Lapping (double side wheel/polishing pad) ⇒ Edge Grinding ⇒ Surface grinding ⇒ polishing⇒ wafer⇒ patterning ⇒ back grinding (vitrified / resin wheels) ⇒ dicing (dicing blades)⇒ chips ⇒ molding ⇒ packaging
Moresuperhard provides a full range of silicon wafer grinding solution and service.

Moresuperhard provides the silicon ingot grinding solution and service.
Our resin bond diamond wheels for peripheral grinding of silicon ingots

Resin bonded diamond grinding wheels for peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat.
Materials used in semiconductors and electronics parts, automobiles and photovoltaic industry. Types of these materials are varied including silicon, sapphire, and gallium arsenide (GaAs).

The bakc grinding wheels include vitrified bond and resin bond diamond wheels.
Application of back grinding wheels: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer

Manufacturing processes for silicon semiconductor
Silicon Ingot ⇒ Cropping(electroplated bandsaw) ⇒ Cylindrical / Flat Grinding Silicon Rod ⇒ Ingot Silicon (diamond wire) ⇒ Lapping (double side wheel/polishing pad) ⇒ Edge Grinding ⇒ Surface grinding ⇒ polishing⇒ wafer⇒ patterning ⇒ back grinding (vitrified / resin wheels) ⇒ dicing (dicing blades)⇒ chips ⇒ molding ⇒ packaging