Superfine diamond polishing paste for metallographic

Silicon wafer back grinding, resin/vitrified bond diamond wheels are used for back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer

Diamond polishing paste is a kind of material for polishing and lapping, which consists of diamond micro powder and corresponding grinding aids.
High precision diamond polishing paste is used for
Polishing of metal workpieces (such as measuring tools, cutting tools, knives, molds, etc.)
-Grinding and polishing of tungsten steel molds, optical molds, injection molds, etc.
-Grinding and polishing of jewelry, jade, gems and agate crafts

Diamond polishing compound for polishing
Grinding and polishing of precision ceramics, magnetic materials, magnetic heads, iron hydrochloride, cemented carbide
Fine grinding of metallographic and petrographic samples of high-hardness materials, etc.
Precision medical equipment, dental materials (dentures) grinding and polishing
Diamond polishing compound has better lubrication and cooling performance, high grinding efficiency, good surface processing quality, better finish, easy to use, etc.

Last week, Moresuperhard participated in the 2nd conference on ceramic technology for semiconductor industry.

We are committed to improving the quality of our products and services to provide customers with better grinding results and value!
Email: [email protected]
Whatsapp: 8615838271917

Moresuperhard provides customized resin or electroplated diamond belts. There are many grinding advantages such as sharpness, durability, flexibility, and dry or wet grinding for diamond sanding abrasive belts with various patterns. Please choose different design patterns according to your needs.

Diamond polishing paste
-Polishing of metal workpieces (such as measuring tools, cutting tools, knives, molds, etc.)
-Grinding and polishing of tungsten steel molds, optical molds, injection molds, etc.
-Grinding and polishing of jewelry, jade, gems and agate crafts
-Optical lenses, crystals, wafers, integrated circuits, quartz wafers, monocrystalline silicon wafers, sapphire, semiconductors
-Grinding and polishing of precision ceramics, magnetic materials, magnetic heads, iron hydrochloride, cemented carbide
-Fine grinding of metallographic and petrographic samples of high-hardness materials, etc.
-Precision medical equipment, dental materials (dentures) grinding and polishing

Moresuperhard can also provide various grain size diamond polishing compound according to users’ requirement and we can also provide CBN polishing compound

Diamond polishing paste, diamond compound is a kind of material for polishing and lapping, which consists of diamond micro powder and corresponding grinding aids.
Diamond polishing paste for Fine grinding of metallographic and petrographic samples of high-hardness materials, etc.

Diamond polishing paste, diamond compound has better lubrication and cooling performance, high grinding efficiency, good surface processing quality, better finish, easy to use, etc.
Diamond suspension and Paste are high quality diamond polishing products that provide repeatable performance and deliver exceptional surface quality.

Diamond Polishing Paste is divided into water-soluble polishing paste and oil-soluble polishing paste
Package of polishing paste: injector, bag or box
Spect: 5g、10g、30g、100g and so on
Diamond size of polishing pase: W0.25 W0.5 W1 W1.5 W2.5 W3.5 W5 W7 W10 W14 W20 W28 W40
Moresuperhard can also provide various of grain size diamond polishing paste according to users’ requirement and we can also provide CBN polishing paste

► Edge wheel for silicon and sapphire wafer edge grinding. A small diameter wheel is used for notch grinding
► Metal diamond wheel for rough grinding to get an accurate edge profile
► Resin diamond wheel for finish grinding to get good surface roughness

Diamond Polishing Paste, Diamond Compound is divided into water-soluble polishing paste and oil-soluble polishing paste
Package: injector, bag or box
Spect: 5g、10g、30g、100g and so on
Diamond size of polishing pase: W0.25 W0.5 W1 W1.5 W2.5 W3.5 W5 W7 W10 W14 W20 W28 W40
Moresuperhard can also provide special products according to users’ requirement and we can also provide CBN polishing paste, CBN compound

Silicon wafer back grinding, resin/vitrified/metal bond diamond wheels are used for back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer

Best suited for demanding applications where a harder-wearing, longer-lasting blade is required.
specifications can be made according to customers requirements

► Polishing and finishing of glass, LCD/LED substrates, precision optics, hard disk, metal and semiconductor wafer surfaces
► Model: MSH-66, MSH-77, MSH-13, MSH-LASER, MSH-46
► Thickness: 0.02″ (0.508 mm) – 0.20″ (5.08 mm)