►High Efficiency ►Long Lifespan ►Wide Range of Applications ►Consistent Performance: ►Low Maintenance
Resin/virtified/metal bond diamond wheel for silicon wafer can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.
Metal bond diamond cup wheels are used for grinding , regrinding carbide, cermet, ceramic, PCD cutting tools, PCBN cutting tools, CVD tools, MCD tools, milling cutter, reamer, drill and regrinding, etc
Applicable areas: fine grinding engine pump body, hydraulic cylinder bore, hydraulic pump inner bore, cylinder block, valve,oil cylinder nozzle, the inner surface of the spline bore and cylinder hole and blind hole of other series.
The single beveled CBN grinding wheel produced by MoreSuperhard can be used for hob grinding. Grinding wheel uses end grinding, the outer circle is very thin, can be ground to the bottom of the edge. CBN grinding wheel are used for forming and grinding of high speed steel (hss) gear hob and thread cutting tools ( hardness above HRC60).
► Steady drilling with better smoothness ► Free drilling and long lifespan ► No damage to the edge ► High drilling efficiency
► Edge wheel for silicon and sapphire wafer edge grinding. A small diameter wheel is used for notch grinding ► Metal diamond wheel for rough grinding to get an accurate edge profile ► Resin diamond wheel for finish grinding to get good surface roughness
► Diamond & CBN honing stone, honing stick ► Bonded: metal bond ► Materials of workpiece: carbide,glass and ceramic,cast iron,alloy steel, tool steel, die steel, hardened steel copper, aluminum alloy and other abrasive resistant materials ► Applicable areas: fine grinding engine pump body, hydraulic cylinder bore, hydraulic pump inner bore, cylinder block, valve,oil cylinder nozzle, the inner surface of the spline bore and cylinder hole and blind hole of other series.
► Application: back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, gallium arsenide, GaN wafers, silicon-based chips, etc
► Grinding Machines: NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc ► Bonded: Vitrified bond & Resin bond ► Diameter (mm): 200mm, 250mm, 280mm, 300mm, 350mm
► Single stroke honing tools, single pass honing reamer (Expansion reamers) ► Single-pass honing tools: electroplated diamond honing reamer and sintered honing reamer ► Vertical single pass honing machines: Sunnen, Engis, Nagel, Belden, etc ► Precision bore finishing
