PRODUCTS
Home > Products > Conventional Abrasive Grinding Wheel
CATEGORY
Diamond Dicing Blades
Ultra - thin diamond dicing blade ( hub type and hubless type) for scribing silicon wafers, compound semiconductor wafers (GaAs, Gap), oxide wafers (LiTaO3), glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter, BGA, CSP, magnetic materials, PCB, silicon
Copyright © 2003-2019 More SuperHard Products Co., Ltd
Home
Whatsapp
E-mail
Inquiry