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metal diamond dicing blades
metal diamond dicing blades
metal diamond dicing blades
metal diamond dicing blades
metal diamond dicing blades
metal diamond dicing blades

Metal bond Diamond Dicing Blades for Silicon Wafer

► 1A8 Ultra- Thin metal diamond dicing blade 

► Thickness of dicing blade: 0.08mm - 2mm

► Silicon wafers of thickness 0.5 mm, 1 mm, 2 mm, 3 mm and 5 mm

► Inducing as low as possible frontside and backside chipping of silicon wafer

► Application: cutting / scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, ceramic, glass, crystal, etc


metal bond diamond dicing blades

silicon wafer dicing blades

diamond dicing blades
Metal bond blades are using sintered metal powder as the bonding agent, have the excellent ability to hold its shape for a longer period of time, high rigidity minimized wavy and slant cutting.
The blades have strong control ability and high wear resistance, it is suitable for precison cutting and slotting machining of electronic components and optical components.

Applications of metal diamond dicing blade

Scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, PCB, ceramic, glass, quartz, crystal, ferrite, optical communication (Faraday), etc
silicon wafer dicing blades
diamond dicing blades


Dresser Board for dressing dicing blades 
Dresser board is used for dressing and edged blade row,  to increase sharpness, and reduce the chipping of the work piece, to reshape and perfect the blade edge to a flat edge
Dresser board Dresser board

How to selection of the correct types of dicing blades to cut materials

* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material

* Binder of metal bond (medium strength) dicing blade

* Binder of electroplated bond (hard bond), scribing softer material

Specifications of metal diamond dicing blades

1A8 SD / CBN OD Thickness
size tolernace size Standard Tolernace High precision Tolernace Size Tolernace
50 - 100 + 0.02 0.1 - 0.15 + - 0.005   25.4
+ - 0.02
0.15 - 0.25 + - 0.005 + - 0.003
> 0.25 + - 0.005 + - 0.003
Special size can be designed depending on customers’ requirement

The case of metal dicing blades for PCB
Workpiece PCB  Material
1.2mm thick resin containing copper layer
dicing blades for pcb material
Dicing Requirements Cutting without burrs
Incision perpendicularity < 0.005mm
Cutting dimensional error < 0.02mm
Snake cutting is not allowed
Scribing Machine Disco DAD3350 scribing machine
Diamond Dicing Blade
metal diamond dicing blades
Metal Diamond dicing blade 
58D x 0.15T x 40H (Grit 400#)
Cutting Parameters 1. Cutting direction: Straight cutting
 2. Spindle speed: 30000rpm
 3. Feed speed: 50mm/S
 4. Cooling water: pure water



Product Name

hub electrofoemed dicing blades
Electroformed dicing blade

Easy to handle

Variety of different grit concentrations

Stable processing performance





Hub dicing blade

Application:  Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

resin bond dicing blades
Resin bond dicing blade

High processing quality for cutting of hard, brittle materials


Improved cut quality on hard materials 









Hubless dicing 


Application:Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter 

metal bond dicing blades
Metal bond dicing balde

High rigidity minimized wavy&slant cutting

Excellent rigidity and cut quality 

Application:  Electronic parts, Optical devices, semiconductor packages, BGA, CSP, 

electroformed dicing blades hubless
Electroformed dicing balde

Wide selection of blade options

Proprietary thin-blade technology

Blade thickness - 0.015 mm to 0.3 mm

Available for both dicing saws and slicers

Application:  Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon 

Other specification can be produced according to customers' requirements

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