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electroformed dicing blade
hub type diamond dicing blades
hub type diamond dicing blades
electroformed dicing blade
hub type diamond dicing blades
hub type diamond dicing blades

Electroformed Diamond Dicing Blades - Hub Type

► Hub type electroforming nickel bonded dicing blade

► Silicon wafers of thickness 0.5 mm, 1 mm, 2 mm, 3 mm and 5 mm

► Inducing as low as possible frontside and backside chipping of silicon wafer

► Applications: dicing silicon wafers, copper wafer and compound semiconductor wafers such as GaAs and SiC.




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electroformed dicing blades - hub type

silicon wafer dicing blades
diamond dicing blades

Performance advantages of electroplating diamond dicing blades (hub type) 
• High toughness, high precision, ultra thin, good chip removal and cooling performance, long service life
• Can carry on the difficult angle cutting and the step cutting processing
• The use of imported diamond abrasive through the electroplating process and precision aluminum alloy flange forming.
• By adjusting the blades strength, can reduce the snake like cutting and blade damage 
• The workpiece has no flying edge, burr residue and high yield
 

Applications of hub type electroformed diamond dicing blade

Scribing dicing IC wafers, gallium arsenide, gallium phosphide, epoxy resin board, alloy frame, ceramic substrate, composite board with interlayer, etc
diamond dicing blades
 

Dresser Board for dressing dicing blades 
Dresser board is used for dressing and edged blade row,  to increase sharpness, and reduce the chipping of the work piece, to reshape and perfect the blade edge to a flat edge
Dresser board Dresser board

 

How to selection of the correct types of dicing blades to cut materials

* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material

* Binder of metal bond (medium strength) dicing blade

* Binder of electroplated bond (hard bond), scribing softer material

Specifications of electroformed dicing blades

Exposure(μm) 380 510 640 760 890 1020 1150 1270 Grit Size
Kerf width(μm) 380-510 510-640 640-760 760-890 890-1020 1020-1150 1150-1270 1270-1400 #5000
#4800
#4500
#4000
#3500
#3000
#2500
#2000
#1800
#1700
#1500
16-20 20*380 20*510            
21-25 25*380 25*510 25*640          
26-30 30*380 30*510 30*640 30*760 30*890 20*1020    
31-35 35*380 35*510 35*640 35*760 35*890 35*1020    
36-40 40*380 40*510 40*640 40*760 40*890 40*1020 40*1150  
41-50 50*380 50*510 50*640 50*760 50*890 50*1020 50*1150  
51-60   60*510 60*640 60*760 60*890 60*1020 60*1150 60*1270
61-70     70*640 70*760 70*890 70*1020 70*1150 70*1270
71-80         80*890 80*1020 80*1150 80*1270
81-90           90*1020 90*1150 90*1270
Special size can be designed according to customers' requirement
 

Types

Features

Product Name

hub electrofoemed dicing blades
Electroformed dicing blade

Easy to handle

Variety of different grit concentrations

Stable processing performance

 

 

 

 

Hub dicing blade

Application:  Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

resin bond dicing blades
Resin bond dicing blade

High processing quality for cutting of hard, brittle materials

 

Improved cut quality on hard materials 

 

 

 

 

 

 

 

 

Hubless dicing 

blade

Application:Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter 

metal bond dicing blades
Metal bond dicing balde

High rigidity minimized wavy&slant cutting

Excellent rigidity and cut quality 

Application:  Electronic parts, Optical devices, semiconductor packages, BGA, CSP, 

electroformed dicing blades hubless
Electroformed dicing balde

Wide selection of blade options

Proprietary thin-blade technology

Blade thickness - 0.015 mm to 0.3 mm

Available for both dicing saws and slicers

Application:  Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon 

Other specification can be produced according to customers' requirements

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